Parker E-DC, Руководство по установке оборудования

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Chapter 2 – Installation 31 E-DC Hardware Installation Guide
M
OUNTING
W
ITHOUT A
H
EATSINK
If you use the E-DC without a heatsink, the next drawing shows the
minimum recommended panel layout. Additional space may be required if
heat dissipation is an issue.
RE
MO
TE
RE
F
CU
RR
EN
T
DU
MP
VD
C+
VD
C-
A+
A-
B+
B-
PW
R/F
LT
!
SE
RIE
S
REMOTE
REF
CURRENT
DUMP
VDC+
VDC-
A+
A-
B+
B-
PWR/FLT
!
SERIES
REMOTE
REF
CURRENT
DUMP
VDC+
VDC-
A+
A-
B+
B-
PWR/FLT
!
SERIES
0.375
(9.52)
REMOTE
REF
CURRENT
DUMP
VDC+
VDC-
A+
A-
B+
B-
PWR/FLT
!
SERIES
REMOTE
REF
CURRENT
DUMP
VDC+
VDC-
A+
A-
B+
B-
PWR/FLT
!
SERIES
4.65
(118.1)
2.35 (59.1)
2 (50.8)
2 (50.8)
Minimum
Dimensions in
inches (millimeters)
Panel Layout Dimensions
The E-DC uses a heatplate design to dissipate heat. The drive should
never be operated for more than a few minutes without properly mounting
the drive to an adequate thermal heatsink.
O
VERTEMPERATURE
P
ROTECTION
The E-DC is overtemperature protected. The drive is designed to operate
in a maximum 50
°
C (122
°
F) ambient with a maximum heatplate tempera-
ture of 55
°
C (131
°
F). Do not allow the drive’s heatplate temperature
to exceed 55
°
C. The drive will fault if its heatplate temperature exceeds
55
°
C.
To measure drive temperature under operating conditions, position a
thermal probe on the left edge of the heatplate, approximately 1.5 inches
(38 mm) from the top of the drive, as shown in the next drawing.
Measure heatplate temperature
on left side, 1.5 inches (38 mm)
from top of drive.
SE
RI
ES
Heatplate Temperature Measurement
To ensure that the over-temperature protection does not unexpectedly
shut down the drive, mount the drive to a suitable heat-dissipating sur-
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