Guide for Getting FPC connector Y5B and Y5BW
Panasonic Corporation
industrial.panasonic.com/ac/e/
©
Panasonic Corporation 2015
ACCTF15E-3 201507
- 10 -
06. Precautions for board/metalmasking/FPC
design
1) Circuit design
(1) Please apply our recommended PC board pattern, window size and thickness of
metalmasking, reflow soldering temperature profile, in order to appropriate
soldering state. When applying the different dimension of a screen, please contact
us as needed.
Note that excess solder on the terminals prevents complete insertion of the FPC,
and causes flux climbing up.
(2) This connector is provided with a soldering terminal for preventing solder from
peeling off the terminal.
Make sure to design a foot pattern for the soldering terminal.
(3) Pay attention to the following points when
providing a through hole by extending the foot
pattern. If a through-hole is created simply by
extending the foot pattern by the same width,
solder is absorbed into the through-hole during
the reflow process, which may cause defective
or poor soldering of the terminals.
1)Thin and extend the tip of the foot pattern
before creating a through-hole.
2)Prevent solder from reaching the land by
using a coverlay or resist.
(4) Foot pattern dimensions indicated in the drawings
are intended to achieve the minimum area on the
premise that the reflow-soldering process is used.
For manual soldering or for ensuring solder
reworkability, please consider making a longer
pattern at the terminal tip.
However, please apply our recommended
metalmasking dimension. It may cause solder
wicking.
Please check the specification sheet about current
recommended reflow soldering temperature profile.
Soldering terminal
In general, 1/3 the
terminal pattern width
Secure space for applying the
soldering iron tip.
Terminal looseness and unwanted solder
creep are preventable by applying the
soldering iron tip here.
(Please do not solder more than necessary.)
