5
2 Warning
2.1.
Prevention of Electrostatic Discharge (ESD) to Electrostatically
Sensitive (ES) Devices
Some semiconductor (solid state) devices can be damaged easily by static electricity. Such components commonly are called Elec-
trostatically Sensitive (ES) Devices. Examples of typical ES devices are integrated circuits and some field-effect transistors and
semiconductor "chip" components. The following techniques should be used to help reduce the incidence of component damage
caused by electrostatic discharge (ESD).
1. Immediately before handling any semiconductor component or semiconductor-equipped assembly, drain off any ESD on your
body by touching a known earth ground. Alternatively, obtain and wear a commercially available discharging ESD wrist strap,
which should be removed for potential shock reasons prior to applying power to the unit under test.
2. After removing an electrical assembly equipped with ES devices, place the assembly on a conductive surface such as alumi-
num foil, to prevent electrostatic charge buildup or exposure of the assembly.
3. Use only a grounded-tip soldering iron to solder or unsolder ES devices.
4. Use only an antistatic solder removal device. Some solder removal devices not classified as "antistatic (ESD protected)" can
generate electrical charge sufficient to damage ES devices.
5. Do not use freon-propelled chemicals. These can generate electrical charges sufficient to damage ES devices.
6. Do not remove a replacement ES device from its protective package until immediately before you are ready to install it. (Most
replacement ES devices are packaged with leads electrically shorted together by conductive foam, aluminum foil or compara-
ble conductive material).
7. Immediately before removing the protective material from the leads of a replacement ES device, touch the protective material
to the chassis or circuit assembly into which the device will be installed.
CAUTION :
Be sure no power is applied to the chassis or circuit, and observe all other safety precautions.
8. Minimize bodily motions when handling unpackaged replacement ES devices. (Otherwise harmless motion such as the
brushing together of your clothes fabric or the lifting of your foot from a carpeted floor can generate static electricity (ESD) suf-
ficient to damage an ES device).
2.2.
How to Recycle the Lithium Ion Battery (U.S. Only)
Содержание HDC-HS100P
Страница 11: ...11 3 5 2 Precautions for installing HDD...
Страница 14: ...14 4 Specifications...
Страница 15: ...15...
Страница 16: ...16 5 Location of Controls and Components...
Страница 17: ...17...
Страница 18: ...18...
Страница 19: ...19...
Страница 20: ...20...
Страница 28: ...28 8 Disassembly and Assembly Instructions 8 1 Disassembly Flow Chart 8 2 PCB Location...
Страница 31: ...31 8 3 2 Removal of the Side Case R Unit Fig D2 Fig D3 8 3 3 Removal of the Side Case L Unit Fig D4...
Страница 32: ...32 Fig D5 8 3 4 Removal of the HDD Unit Fig D6...
Страница 33: ...33 8 3 5 Removal of the Top Case Unit Fig D7 8 3 6 Removal of the Front Case Unit Fig D8...
Страница 34: ...34 8 3 7 Removal of the Battery Case Unit Fig D9 8 3 8 Removal of the Lens Unit Fig D10...
Страница 36: ...36 8 3 12 Removal of the Flash P C B Fig D14 Fig D15...
Страница 38: ...38 Fig D20 8 3 16 Removal of the Monitor P C B Fig D21 Fig D22...
Страница 39: ...39 8 3 17 Removal of the LCD Fig D23 8 3 18 Removal of the Mic P C B Fig D24...
Страница 40: ...40 8 3 19 Removal of the Barrier Motor Unit and MF Unit Fig D25 Fig D26...
Страница 41: ...41 8 3 20 Removal of the Mic Mic Damper Fig D27 8 3 21 Removal of the Power FPC Unit Fig D28...
Страница 45: ...45 Fig D39 8 3 30 Removal of the IRIS Unit Fig D40 Fig D41...
Страница 79: ...S 30...
Страница 90: ...S7 3 LCD Section S 41 158 157 154 155 156 153 B151 B152 151 159 160 152 161 162...