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6
BASEBAND OVERVIEW
6.1
Introduction
All Baseband circuitry is contained on one PCB. The Baseband PCB has six layers made from FR4 material. Top
and bottom layers are gold-plated to prevent oxidization and enable better soldering. The board thickness is 1.0mm
(+0.0, -0.1mm).
The Baseband board is connected to the RF board via a 50 way dual in line connector.
A metallised plastic chassis is used to separate the Baseband and the RF PCB’s. The continuous chassis design is
important for EMC purposes. When the chassis is sandwiched between the Baseband and the RF PCB’s the
ground plane of the RF board together with the chassis forms an effective shielded enclosure, which prevents
spurious emissions.
6.2
Functional Description
The G600 baseband is based around a 2 chip GSM chipset. One chip carries out signal processing with DSP and
CPU, called GEMINI, and the other chip contains the analogue interface chip, called VEGA. The highly integrated
nature of these components means each contain a large number of functions.
Figure 1:
Baseband Block Diagram
600-0601
MCUK980101G8
Section 6
Issue 1
Technical Guide
6 - 1
Revision 0
BASEBAND OVERVIEW
GEMINI
TIMER
TDMA
GSM
TPU
DSP
CORE
SIM
I/F
JTAG
DSP ROM
DSP RAM
IRQ
MEM
I/F
SERIAL I/F
I/O
PWM
UART
ARM
3V to 5V
DC/DC
SIM
CONNECTOR
RAM
256k x 8
FLASH
1M x 16
VOICE
MEMO
EEPROM
2k *8 serial
KEYPAD
BACKLIGHT
VOLTAGE
REGULATOR
VEGA
TIMING
JTAG
10 bit
DAC
SP
INTERF
ACE
RF
INTERF
ACE
BATTERY
HANDS FREE
INTERFACE
I TX
Q TX
I RX
Q RX
PA RAMP
TCVCXO CONTROL
TCVCXO TEMP
AUDIO
OUT
AUDIO
IN
RADIO
MUTE
IGNITION
EXTERNAL
POWER
UAR
T
IN
UAR
T
OUT
3V
POWER KEY