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Assembly
The assembly process is broken down into separate steps. These steps are based on
the sequence of labs the Proto Base is designed to implement. It is very important that
these steps are followed in order and that the assembler does not go further ahead
than instructed.
For each part of the assembly process, Out of the Box recommends the use of flux
when soldering and an iron temperature of 615˚ to 650˚ F. When soldering a multi-pin
header, initially solder just one pin. Before proceeding to solder the remaining pins,
ensure proper placement. If needed adjustments can be made by melting the joint.
Then when satisfied the remaining pins should be soldered. Finally pay close
attention to which side of the board the components should be soldered to.
Module 1
Figure 3: Bare Proto Base without uPad (TOP of board)
Above is the bare top of the Proto Base with the uPAD removed. The components that
are to be soldered in this module are highlighted in red and blue. Red components
are soldered to the pads on the top of the board, and blue components are soldered to
the bottom of the board. For headers red means the long portion of the pins will point
out of the bottom of the board, and blue ones will point out the top.
Step 0: Breaking Headers to Size
In order to do the following steps you will need to break apart some of the headers in
your kit accordingly. These headers will be used for the steps to follow. Make sure to
hold onto all of your extra 40 pin headers and partial headers.
