Oracle Database Appliance X3-2, Руководство по обслуживанию

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Remove Replaceable Components From Motherboard Assembly
Chapter 5 • Servicing FRUs 133
Callout Description Callout Description
1 CPUs and Heatsinks 6 Internally Mounted PCIe Card
2 Memory modules (DIMMs) 7 Boot Disk Drives (2)
3 PCIe Cards mounted on the PCIe Riser 8 Boot Disk Drive Backplane
4 PCIe Riser 9 Battery
5 Fan Modules (2)
The following topics are covered in this section:
■
“Remove Replaceable Components From Motherboard Assembly” on page 133
■
“Install Replaceable Components in Motherboard Assembly” on page 134
Remove Replaceable Components From Motherboard
Assembly
1. Prepare the server node for service.
a.
Attach an antistatic wrist strap.
See “Performing Electrostatic Discharge and Antistatic Prevention Measures” on page 34 .
b. Remove the server node from the system.
Power is removed from the server node when you remove it from the system. See
“Removing Server Nodes From the System Chassis” on page 34 .
c. Remove the server node top cover.
See “Removing the Server Node Top Cover” on page 35 .
2. With the exception the SAS expander cable, disconnect and remove all internal
cables from the server node.
Note -
To identify the SAS expander cable, see “Install SAS Expander Cable” on page 129 .
The cables for the fans, the primary and secondary HBA PCIe cards, and the boot disk
backplane must be removed.
■
Fan power cables
See Remove
“Remove Fan Power Cables” on page 122 .
■
Primary HBA PCIe card data cables
See
“Remove PCIe Card Cables From Primary HBA PCIe Card” on page 124 .
■
Secondary HBA PCIe card data cables