H77
II
Table of Contents
Chapter 1
Introduction
1-1
Product Highlights
1-1
Mechanical Specifications
1-2
Electrical Specifications
1-2
Optical Specifications
1-5
Environmental Specifications
1-5
Chapter 2
Disassembly Procedure
2-1
Tools Needed
2-1
Removing Lamp Module
2-2
Removing I/O Panel, Top Cover and Keypad Board
2-3
Removing Thermal Board, Main Board,
Connector Board and Power Module
2-5
Removing Fan Module(92x25mm), Lamp Ballast,
Power Board and DMD Board
2-7
Removing DMD Chip, Front Panel Module
and Fan Module (50x15mm)
2-9
Removing Air Duct Module, Engine Module and Fan Module
2-10
Chapter 3
Troubleshooting
3-1
Equipment Needed
3-1
Main Procedure
3-1
Chapter 4
Function Test and Alignment Procedure
4-1
Product
4-1
Test Equipment
4-1
Test Condition
4-1
Test Display Modes and Pattern
4-2
Inspection Procedure
4-6
Chapter 5
Firmware Upgrade Procedure
5-1
Equipment Needed
5-1
Setup Procedure
5-2
Firmware Upgrade Procedure
5-3