ON Semiconductor NTB30N20, Руководство пользователя

Страница: 7 / 8

NTB30N20
http://onsemi.com
7
PACKAGE DIMENSIONS
D
2
PAK
CASE 418B−04
ISSUE J
STYLE 2:
PIN 1. GATE
2. DRAIN
3. SOURCE
4. DRAIN
SEATING
PLANE
S
G
D
−T−
M
0.13 (0.005) T
2 3 1
4
3 PL
K
J
H
V
E
C
A
DIM MIN MAX MIN MAX
MILLIMETERS INCHES
A 0.340 0.380 8.64 9.65
B 0.380 0.405 9.65 10.29
C 0.160 0.190 4.06 4.83
D 0.020 0.035 0.51 0.89
E 0.045 0.055 1.14 1.40
G 0.100 BSC 2.54 BSC
H 0.080 0.110 2.03 2.79
J 0.018 0.025 0.46 0.64
K 0.090 0.110 2.29 2.79
S 0.575 0.625 14.60 15.88
V 0.045 0.055 1.14 1.40
−B−
M
B
W
W
NOTES:
1. DIMENSIONING AND TOLERANCING
PER ANSI Y14.5M, 1982.
2. CONTROLLING DIMENSION: INCH.
3. 418B−01 THRU 418B−03 OBSOLETE,
NEW STANDARD 418B−04.
F 0.310 0.350 7.87 8.89
L 0.052 0.072 1.32 1.83
M 0.280 0.320 7.11 8.13
N 0.197 REF 5.00 REF
P 0.079 REF 2.00 REF
R 0.039 REF 0.99 REF
M
L
F
M
L
F
M
L
F
VARIABLE
CONFIGURATION
ZONE
R
N P
U
VIEW W−W VIEW W−W VIEW W−W
1 2 3
*For additional information on our Pb−Free strategy and soldering
details, please download the ON Semiconductor Soldering and
Mounting Techniques Reference Manual, SOLDERRM/D.
SOLDERING FOOTPRINT*
8.38
0.33
1.016
0.04
17.02
0.67
10.66
0.42
3.05
0.12
5.08
0.20
ǒ
mm
inches
Ǔ
SCALE 3:1