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NTB30N20

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5

30

0

1

0.5

DRAIN−TO−SOURCE DIODE CHARACTERISTICS

V

SD

, SOURCE−TO−DRAIN VOLTAGE (VOLTS)

Figure 8. Gate−To−Source and Drain−To−Source

Voltage versus Total Charge

I S

, SOURCE CURRENT

 (AMPS)

Figure 9. Resistive Switching Time

Variation versus Gate Resistance

R

G

, GATE RESISTANCE (

W

)

1

10

100

1000

1

t, TIME 

(ns)

V

DD

 = 160 V

I

D

 = 30 A

V

GS

 = 10 V

V

GS

 = 0 V

T

J

 = 25

°

C

Figure 10. Diode Forward Voltage versus Current

180

V

GS

, GA

TE−T

O−SOURCE 

VOL

T

AGE 

(VOL

TS)

150

120

90

60

30

0

10

6

2

0

Q

G

, TOTAL GATE CHARGE (nC)

V

DS,

DRAIN−T

O−SOURCE VOL

T

AGE 

(VOL

TS)

12

8

4

20

70

40

0

10

10

50

30

60

0.6

0.7

0.8

0.9

10

15

20

5

25

I

D

 = 30 A

T

J

 = 25

°

C

V

GS

Q

2

Q

1

Q

T

V

DS

t

r

t

d(off)

t

d(on)

t

f

100

SAFE OPERATING AREA

The Forward Biased Safe Operating Area curves define

the maximum simultaneous drain−to−source voltage and
drain current that a transistor can handle safely when it is
forward biased. Curves are based upon maximum peak
junction temperature and a case temperature (T

C

) of 25

°

C.

Peak repetitive pulsed power limits are determined by using
the thermal response data in conjunction with the procedures
discussed in AN569, “Transient Thermal
Resistance−General Data and Its Use.”

Switching between the off−state and the on−state may

traverse any load line provided neither rated peak current
(I

DM

) nor rated voltage (V

DSS

) is exceeded and the

transition time (t

r

,t

f

) do not exceed 10 

m

s. In addition the total

power averaged over a complete switching cycle must not
exceed (T

J(MAX)

 − T

C

)/(R

q

JC

).

A Power MOSFET designated E−FET can be safely used

in switching circuits with unclamped inductive loads. For

reliable operation, the stored energy from circuit inductance
dissipated in the transistor while in avalanche must be less
than the rated limit and adjusted for operating conditions
differing from those specified. Although industry practice is
to rate in terms of energy, avalanche energy capability is not
a constant. The energy rating decreases non−linearly with an
increase of peak current in avalanche and peak junction
temperature.

Although many E−FETs can withstand the stress of

drain−to−source avalanche at currents up to rated pulsed
current (I

DM

), the energy rating is specified at rated

continuous current (I

D

), in accordance with industry custom.

The energy rating must be derated for temperature as shown
in the accompanying graph (Figure 12). Maximum energy at
currents below rated continuous I

can safely be assumed to

equal the values indicated.

Содержание NTB30N20

Страница 1: ...RG 25 W EAS 450 mJ Thermal Resistance Junction to Case Junction to Ambient Junction to Ambient Note 1 RqJC RqJA RqJA 0 7 62 5 50 C W Maximum Lead Temperature for Soldering Purposes for 10 seconds TL...

Страница 2: ...tance VDS 15 Vdc ID 15 Adc gFS 20 Mhos DYNAMIC CHARACTERISTICS Input Capacitance VDS 25 Vdc VGS 0 Vdc f 1 0 MHz Ciss 2335 pF Output Capacitance VDS 25 Vdc VGS 0 Vdc f 1 0 MHz VDS 160 Vdc VGS 0 Vdc f 1...

Страница 3: ...6 0 05 0 0 1 Figure 5 On Resistance Variation with Temperature TJ JUNCTION TEMPERATURE C 3 2 1 5 1 0 5 175 125 100 75 50 25 0 25 50 VDS DRAIN TO SOURCE VOLTAGE VOLTS 40 20 1000 100 10 0 100000 Figure...

Страница 4: ...t a voltage corresponding to the on state when calculating td off At high switching speeds parasitic circuit elements complicate the analysis The inductance of the MOSFET source lead inside the packag...

Страница 5: ...ermal Resistance General Data and Its Use Switching between the off state and the on state may traverse any load line provided neither rated peak current IDM nor rated voltage VDSS is exceeded and the...

Страница 6: ...0 10 0 1 0 01 0 001 0 0001 0 00001 TJ STARTING JUNCTION TEMPERATURE C E AS SINGLE PULSE DRAIN TO SOURCE Figure 12 Maximum Avalanche Energy versus Starting Junction Temperature 0 1 1 0 100 VDS DRAIN T...

Страница 7: ...45 0 055 1 14 1 40 B M B W W NOTES 1 DIMENSIONING AND TOLERANCING PER ANSI Y14 5M 1982 2 CONTROLLING DIMENSION INCH 3 418B 01 THRU 418B 03 OBSOLETE NEW STANDARD 418B 04 F 0 310 0 350 7 87 8 89 L 0 052...

Страница 8: ...product could create a situation where personal injury or death may occur Should Buyer purchase or use SCILLC products for any such unintended or unauthorized application Buyer shall indemnify and hol...

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