ON Semiconductor CAT24C01, Руководство пользователя

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CAT24C01, CAT24C02, CAT24C04, CAT24C08, CAT24C16
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17
PACKAGE DIMENSIONS
WLCSP4, 0.84x0.86
CASE 567DC
ISSUE D
SEATING
PLANE
0.10 C
NOTES:
1. DIMENSIONING AND TOLERANCING PER ASME
Y14.5M, 1994.
2. CONTROLLING DIMENSION: MILLIMETERS.
3. DATUM C, THE SEATING PLANE, IS DEFINED BY
THE SPHERICAL CROWNS OF THE CONTACT
BALLS.
4. COPLANARITY APPLIES TO SPHERICAL CROWNS
OF THE CONTACT BALLS.
5. DIMENSION b IS MEASURED AT THE MAXIMUM
CONTACT BALL DIAMETER PARALLEL TO DATUM C.
2X
DIM
A
MIN MAX
0.28
MILLIMETERS
A1
D 0.84 BSC
E
b 0.16 0.20
e 0.40 BSC
0.38
ÈÈ
ÈÈ
D
E A B
PIN A1
REFERENCE
e
0.05 C
4X
b
1 2
B
A
0.10 C
A1
A2
C
0.08 0.12
0.86 BSC
0.10 C
2X
TOP VIEW
SIDE VIEW
BOTTOM VIEW
NOTE 4
e
A2 0.23 REF
PITCH
0.18
4X
DIMENSIONS: MILLIMETERS
*For additional information on our Pb − Free strategy and soldering
details, please download the ON Semiconductor Soldering and
Mounting Techniques Reference Manual, SOLDERRM/D.
SOLDERING FOOTPRINT*
0.40
0.40
RECOMMENDED
A1
PACKAGE
OUTLINE
PITCH
NOTE 3
A
NOTE 5
A
M
0.10 B C
DETAIL A
A3* 0.025 REF
* Die Coat (Optional)
DETAIL A
A2
A A3*
* Die Coat
(Optional)