channels supported. It may also include functional connections between the module
instances and other modules. Read this section first because its content is crucial to
understanding the information in other sections of the chapter.
• General: The subsequent sections provide general information about the module,
including its signals, registers, and functional description.
NOTE
If there is a conflict between the chip-specific module
information (first section) and the general module information
(subsequent sections), the chip-specific information supersedes
the general information.
Chapter 49
Enhanced Serial Communication Interface (eSCI)
49.1 Chip-specific eSCI information
This chip has six instances of the eSCI module. Some feature details vary between the
instances.
The following table summarizes the feature differences. The table does not list feature
details that the instances share.
Table 49-1. eSCI instance feature differences
Instance
DMA support
eSCI_A and eSCI_B
Yes
eSCI_C, eSCI_D, eSCI_E, and eSCI_F
No: descriptions of eSCI DMA functionality do not apply to
these instances
NOTE
For eSCI_D, the single wire feature does not apply for TX/RX
via PCSA3 because this pad works only as an output.
49.2 Introduction
The eSCI block is an enhanced SCI block with a LIN master interface layer and DMA
support. The LIN master layer complies with the specifications LIN 1.3, LIN 2.0, LIN
2.1, and SAE J2602/1.
49.2.1 Bibliography
• LIN Specification Package Revision 1.3; December 12, 2002
• LIN Specification Package Revision 2.0; September 23, 2003
Sample Reference Manual
EXAMPLE
Chip-specific information
that should be read first
Beginning of general
module information
Figure 1-1. Example: chapter chip-specific information and general module information
Module descriptions
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