N1_Hardware_User_Guide
Copyright © Neoway Technology Co., Ltd
16
2.4 PCBFoot Print
The N1 module adopts LCC packaging. Figure 2-2 shows the recommended PCB foot print. (Unit: mm)
Figure 2-2
PCC foot print recommended for N1
The thickness of the solder paste and PCB flatness are key to the acceptance rate during the production. It
is recommended to prepare 0.15 mm to 0.20 mmstencil for mounting N1 and the stencil apertures should
be smaller than the pads of the module.If the PCB boards are too thin or long,please use conveyors during
SMT or reflow soldering process in case of improper soldering due to PCB bow and twist.
To ensure that themodule is soldered properly, reserve more than 3 mm between the module and other
components in design.
