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N1_Hardware_User_Guide

Copyright © Neoway Technology Co., Ltd

42

Figure 6-2

USB circuit (with OTG)

USB_DM

USB_DM

USB_DP

USB_DP

GND

GND

USB_HS_ID

USB_HS_ID

0

Ω

0

Ω

0

Ω

0

Ω

E

S

D

9X

5V

U

E

S

D

9X

5V

U

GPIO

GPIO

VBAT

VBAT

VBAT

VBAT

VIN

VIN

AW3610

AW3610

SW

SW

1UH

1UH

E

S

D

9X

5V

U

E

S

D

9X

5V

U

VBUS_USB_IN

VBUS_USB_IN

MICRO USB

MICRO USB

USB_HS_ID

USB_HS_ID

USB_DP

USB_DP

USB_DM

USB_DM

VBUS_USB_IN

VBUS_USB_IN

P

E

S

D

5V

0S

1B

L

P

E

S

D

5V

0S

1B

L

EN

EN

VOUT

VOUT

VOUT

VOUT

GND

GND

AM809

AM809

22PF

22PF

1UF

1UF

N1supports USB OTG. Refer to the above circuit to use the USB OTG function. Developers can select the
DC-DC model based on requirements.

6.2

U

IM Card Interface

N1supports 1.8V/2.85V SIM cards. N1allows dual SIM cards. VREG_UIM is the power supply pin of the
SIM card and its maximum load is 30 mA. The UIM_DATA pin is not pulled up internally, so need to
reserve external pull-up resistor in design. UIM_CLK is the clock signal pin, supporting 3.25 GHz of
clock frequency. Figure 6-3 shows the reference design of the SIM card interface.

Figure 6-3

Reference design of SIM card interface

1 uF

UIM_DATA

UIM_CLK

UIM_RST

VREG_UIM

N1

CLK

RST

VCC

VPP

GND

SIM card

DATA

GND

SIM-Det

UIM_DETECT

10K

ESD protectors, such as ESD diodes or ESD varistors (with a junction capacitance of less than 33 pF), are
recommended on the SIM signals, especially in automotive electronics or other applications with badESD.
Replace the ESD diodes with 27 pF to 33 pF capacitors connecting to GND in common applications. The
ESD diodes or small capacitors should be close to SIM card.

N1supports SIM card detection. SIM1_DETECT/ SIM2_DETECT are 1.8V interrupt pins. Low level
indicates SIM card detected while high level means no SIM card detected.

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Содержание N1 CN

Страница 1: ...N1_Hardware_User_Guide Copyright Neoway Technology Co Ltd i N1Hardware User Guide Version 1 6...

Страница 2: ...eers and test engineers The information in this document is subject to change without notice due to product version update or other reasons Every effort has been made in preparation of this document t...

Страница 3: ...terfaces 17 3 1 Power Supply 17 3 2 Power On 20 3 3 Hard Reset 21 3 4 Hard Power off 22 3 5 VRTC Power Supply 22 3 6 Battery Management 23 4 Video I O Interfaces 25 4 1 LCD Interfaces 25 4 1 1 WVGA 25...

Страница 4: ...PCB Layout 49 7 3 GPS RF Design and PCB Layout 51 7 3 1 GPS Impedance 51 7 3 2 Active GPS Antenna Design 51 7 3 3 Passive GPS Antenna Design Reference 52 7 4 FM RF Design and PCB Layout 53 8 Commissio...

Страница 5: ...ence 22 Figure 3 12 VRTC design in the module 22 Figure 3 13 Battery connections 24 Figure 4 1 Reference MIPI circuits with common mode chokes 26 Figure 4 2 N1LCD backlight chipset 27 Figure 4 3 Power...

Страница 6: ...of the SPI 46 Figure 6 8 Reference design of motor circuit 47 Figure 7 1 Reference of antenna matching design 48 Figure 7 2 Recommended RF PCB design 48 Figure 7 3 Encapsulation specifications of Mur...

Страница 7: ...Main camera pins 31 Table 4 5 Sub camera pins 32 Table 5 1 Audio input pins 37 Table 5 2 Audio output pins 38 Table 5 3 Headphone pins 38 Table 6 1 TF card pins 43 Table 6 2 GPIO pins 44 Table 6 3 ADC...

Страница 8: ...the reflow temperature Li 2016 07 V1 3 Modified the description of battery design Modified the parameters of power supply driver Supplemented reference level Li 2016 08 V1 4 Added EU and NA frequency...

Страница 9: ...Quad core ARM Cortex A7 processors 1 3 GHz main frequency 512KB L2 cache 28 nm 8Gb LPDDR2 RAM 8GB Nand Flash expandable up to 32 GB eMMC interface GSM WCDMA HSPA 42 Mbps CDMA2000 EV DOrA LTE Cat 4 Wi...

Страница 10: ...ment RF Section LCD MIPI TP MIPI Main Sub Cam MIPI USB UART SPI I2C GPIO PWM Power supply input Memory Baseband 4G DRX GPS Audio 2G 3G 4G BT Wi Fi ADC Charge Analog interface Digital interface 1 3 Fea...

Страница 11: ...ultimedia processor QDSP6 v5 core Operation frequency 691 MHz 768KB L2 RF feature Band N1_CN GSM GPRS EDGE 850M 900M 1800M 1900M TD SCDMA B34 B39 CDMA2000 1x EVDO BC0 UMTS B1 B8 FDD LTE B1 B3 TDD LTE...

Страница 12: ...supporting at most 8MP Front camera uses 1 lane MIPI_CSI supporting at most 3MP Video processing Coding H 264 BP MP HD 30 fps MPEG 4 SP H 263 P0 WVGA 30 fps VP8 WVGA 30 fps Decoding H 264 BP MP HP RES...

Страница 13: ...d interface a maximum transmitting rate of 480 Mbps SDIO Supporting SD3 0 and SD MMC cards 4 bit SDIO Wireless connection WLAN 2 4G single band supporting 802 11b g n at most 150Mbps Wake on WLAN WoWL...

Страница 14: ...hnology Co Ltd 6 2 Pin Description and PCB Foot Print 2 1 Specifications and Pin Definition Table 2 1 N1 dimensions Specifications N1 Dimensions 40 0 1 mm 40 0 1 mm 2 8 0 1 mm H W D Weight 9 0g Packag...

Страница 15: ...ate Function 1 Alternate Function 2 Alternate Function 3 1 VIB_DRV_N MOTOR 2 3 VBAT VBAT 3 5 4 2V 4 5 VBUS_USB_IN USB Power 5V 6 GND GND 7 USB_DM USB 8 USB_DP USB 9 GND GND 10 USB_HS_ID USB 1 8V high...

Страница 16: ..._DATA3 TF 25 SDC2_CMD TF 26 VREG_SDC_PWR TF 2 95V 27 SDC2_CLK TF 28 SDC2_DATA0 TF 29 SDC2_DATA1 TF 30 SD_CARD_DET_N TF 1 8V 38 SD_CARD_DET_ N CCI_TIMER2 31 GND GND 32 GPIO_15 1 8V 15 BLSP4_SPI_CLK BLS...

Страница 17: ...1_M LCD 43 MIPI_DSI0_CLK_M LCD 44 MIPI_DSI0_CLK_P LCD 45 MIPI_DSI0_LANE2_P LCD 46 MIPI_DSI0_LANE2_M LCD 47 MIPI_DSI0_LANE3_M LCD 48 MIPI_DSI0_LANE3_P LCD 49 MIPI_DSI0_LANE0_M LCD 50 MIPI_DSI0_LANE0_P...

Страница 18: ...RA 62 MIPI_CSI1_CLK_M FRONT CAMERA 63 GND 64 CAM0_MCLK REAR CAMEAR 26 CAM_MCLK0 GP_PDM_0B 65 CAM1_MCLK FRONT CAMERA 27 CAM_MCLK1 GP_PDM_1B 66 GND 67 ANT WIFI BT ANT WIFI BT 68 GND 69 CAM0_RST_N REAR C...

Страница 19: ...2C_S CL 1 8V 7 BLSP1_SPI_CLK BLSP1_UART_RF R_N BLSP1_I2C_SCL 78 SENSORS_I2C_SDA SENSORS_I2C_S DA 1 8V 6 BLSP1_SPI_CS_N BLSP1_UART_C TS_N BLSP1_I2C_SDA 79 UART1_MSM_RX 1 8V 5 BLSP1_SPI_MISO BLSP1_UART_...

Страница 20: ...I2C_SCL 1 8V 112 BLSP2_SPI_CLK BLSP2_UART_RF R_N BLSP2_I2C_SCL 98 I2C_SDA 1 8V 111 BLSP2_SPI_CS_N BLSP2_UART_C TS_N BLSP2_I2C_SDA 99 UART2_MSM_RX 1 8V 21 UIM3_PRESENT BLSP2_SPI_MISO BLSP2_UART_R X 100...

Страница 21: ...LSP6_SPI_CS_N 112 BLSP6_SPI_MISO 1 8V 9 BLSP6_SPI_MISO 113 BLSP6_SPI_MOSI 1 8V 8 BLSP6_SPI_MOSI 114 GPIO_16 1 8V 16 BLSP5_SPI_MOSI 115 GND 116 ANT_GPS 117 GND 118 GPIO_17 1 8V 17 BLSP5_SPI_MISO BLSP2_...

Страница 22: ...G_L6_1P8 VREG_L6_1P8 1 8V 127 VREG_L17_2P85 VREG_L17_2P85 2 85V 128 PM_GPIO_4 PM GPIO _4 PM GPIO_4 129 ADC_IN ADC_IN PM MPP_ 4 PM MPP_4 130 VBAT_THERM VBATTERY Connected to 10K NTC pull down resistor...

Страница 23: ..._P HEADSET 144 GND_MIC HEADSET 145 GND 146 ANT FM FM_ANT 147 GND 148 MIC1_N PRIMARY MIC 149 MIC1_P PRIMARY MIC 150 GND 151 SPKR_DRV_M SPKR 152 SPKR_DRV_P SPKR 2 3 GPIOReference Level Level Status I O...

Страница 24: ...re key to the acceptance rate during the production It is recommended to prepare 0 15 mm to 0 20 mmstencil for mounting N1 and the stencil apertures should be smaller than the pads of the module If th...

Страница 25: ...supply N1 Close to the module D1 C1 C2 C3 C4 C5 VBAT Test point I_max Power supply In Figure 3 1 use TVS at D1 to enhance the performance of the module during a burst SMF5 0AG Vrwm 5V Pppm 200W is re...

Страница 26: ...r off on can rectify the module exceptions In Figure 3 3 the module is turned on when PWR_EN is set to high level Figure 3 3 Reference design of power supply controlled by p MOSFET VCC_IN_3 9V VBAT 10...

Страница 27: ...7Hz TDD noise through power One of the way of generating noise Another way is through RF radiation Analog parts especially the audio circuits are subjected to this noise known as a buzz noise in GSM s...

Страница 28: ...low level pulse for 3 seconds This pin is pulled up internally Its typical high level voltage is 1 8 V Do not leave this pin unconnected The following circuitsare recommended to control PWR_N Figure 3...

Страница 29: ...e is 1 8 V Leave this pin unconnected if it is not used If a 2 8V 3 3V IO system is used separate it by adding a triode Refer to the following design Figure 3 8 Reset controlled by button R1 S1 RESIN_...

Страница 30: ...Reset Figure 3 11 shows the hard power off sequence Figure 3 11 N1power off sequence VBAT OTHERS 13s PWR_N Not defined 3 5 VRTC Power Supply Pin Signal I O Function Remarks 125 VRTC I O RTC power supp...

Страница 31: ...age is between 3 2 V and 4 2 V A max current of 1 44 A if using an adapter A current of 450 mA if using USB Constant voltage charging The battery voltage remains at 4 2v while the charge current drops...

Страница 32: ...N1_Hardware_User_Guide Copyright Neoway Technology Co Ltd 24 Figure 3 13 Battery connections N1 VREF_BAT_THM VBAT_THERM PMIC VBAT R1 R2 R_TH GND Battery Module C1 C2 TVS...

Страница 33: ...tions describes the hardware configuration of WVGA display that Neoway commissioned The resolutionof WVGA display is 800 x 480 which requires 2 lane MIPI_DSI LCD design is generally to connect FPC to...

Страница 34: ...MIPI circuit to reduce the electromagnetic interference Figure 4 1 shows the reference circuits with common mode choke Please refer to 4 4 Design Precautions to be considered during design Figure 4 1...

Страница 35: ...lled by the PWM signal from the module To control the power supply completely and reduce the standby power consumption use independent LDO to supply power to the backlight 2 85V LDO circuit is recomme...

Страница 36: ...CD LCD_TE VREG_L14_1P8V LED_K TS_RST_N TS_I2C_SDA MIPI_DSI0_D2_P_LCD MIPI_DSI0_CLK_M_LCD MIPI_DSI0_D1_P_LCD VEXT_2P85V TS_INT_N AVL 5 5V 100PF 4 1 2 720P To adopta 720P touch panel 4groups of MIPI_DSI...

Страница 37: ...V AO LDO output 35 TS_RST_N DO Reset touchscreen Triggered by low level 120 TS_I2C_SCL DO I2C clock 119 TS_I2C_SDA DIO I2C data 34 TS_INT_N DI Touchscreen interrupt 4 2 TP Interfaces TPmight not be on...

Страница 38: ...developed based on the MIPI_CSI standard and support two cameras among which the pixel can be at most 8MP The quality of video and photo is dependent on the camera sensor the camera specifications an...

Страница 39: ...lock 70 CAM0_PWDN Power off 74 CAM _I2C_SDA I2C data 73 CAM _I2C_SCL I2C clock VEXT_2P85 LDO output VEXT_CAM_1P2V LDO output VEXT_CAM_1P8V LDO output LDO supplies power to VEXT_2P85 VEXT_CAM_1P2V and...

Страница 40: ...DN_VCM VREG_L6_1P8 EXT_1V2_DVDD VEXT_2V85_AVDD 4 3 2 Sub Camera Sub camera uses one lane MIPI_CSI differential signal and supports 2MP cameras Table 4 5 lists sub camera pins Table 4 5 Sub camera pins...

Страница 41: ...M MIPI_CSI1_CLK_M MIPI_CSI1_CLK_P CAM1_PWDN EXT_1V2_DVDD 2 2uF 0 1uF 4 3 3 Design Precautions Please note the scanning direction of the camera the aiming direction and angle of the camera lens the sca...

Страница 42: ...e design of customized camera Images from the camera to the LCD can be adjusted in only four ways Figure 4 10 Adjustment of camera sensor Images can be displayed correctly only when the camera sensor...

Страница 43: ...CE VDD SGM2036 VBATT_FET GND 100K VEXT_2P85V 1 2 5 3 4 DNI 0 VREG_L17_2P85V 1 2V level input is required for main camera Figure 4 12 shows the reference design Figure 4 12 Reference design of the mai...

Страница 44: ...0 for the differential pair of traces which must be routed on the inner layer to isolate from other signal traces Keep length matching for the MIPI traces of one video component Reserve 1 5 times of t...

Страница 45: ...in MIC 149 MIC1_P AI Positive pin of MIC1 output Main MIC 143 MIC2_P AI Positive pin of MIC2 output Sub MIC Figure 5 1 shows the differential connection of the peripheral A bias circuit is embedded fo...

Страница 46: ...noise rejection Figure 5 2 shows the reference design of the audio output pins Figure 5 2 Reference design of EAR SPK connections 33 pF 33 pF EAR SPK EAR SPK 33 pF N1 EAR SPK 1800 25 100MHz 1800 25 10...

Страница 47: ...3 4 1 5 2 V V 10K 1000 25 100MHz 1000 25 100MHz 1000 25 100MHz 1000 25 100MHz 1000 25 100MHz 1000 25 100MHz V 10K 33pF 470pF AVL 5 5V 100PF AVL 5 5V 100PF AVL 5 5V 100PF 470pF DNI 33pF PESD5V0S1B L H...

Страница 48: ...h the left channel 8 16 32 loudspeaker of the headphone 5 4 Audio Design Precautions The audio signal traces should be wide enough on the PCB to bear large current when the module outputs audio at the...

Страница 49: ...to detect USB connection and charge the battery through the PMU inside the module The voltage ranges from 4 35 V to 6 3 V and the typical value is 5 V The charging circuit embedded in the module suppo...

Страница 50: ...maximum load is 30 mA The UIM_DATA pin is not pulled up internally so need to reserve external pull up resistor in design UIM_CLK is the clock signal pin supporting 3 25 GHz of clock frequency Figure...

Страница 51: ...e SDIO protocol and the latest SDIO 3 0 protocol 6 3 1 SD Card Figure 6 4 shows the reference design of the camera power supply Figure 6 4 Reference design of TF card interface DAT2 CD DAT3 CMD VDD TF...

Страница 52: ...arately 6 3 2 SD Peripheral Interface SDIO interface can connect other peripherals Refer to the SD card connection design and connect the module pin to the peripheral pin directly PCB layout is simila...

Страница 53: ...I_CS_N BLSP6_SPI_CS_N 10 112 BLSP6_SPI_MISO BLSP6_SPI_MISO BLSP6_SPI_MISO 9 113 BLSP6_SPI_MOSI BLSP6_SPI_MOSI BLSP6_SPI_MOSI 8 114 GPIO_16 GPIO_16 BLSP5_SPI_MOSI 16 118 GPIO_17 GPIO_17 BLSP5_SPI_MISO...

Страница 54: ...2C 2 2K 2 2K 1 8V I2C SCL I2C SDA I2C SCL I2C SDA 6 4 3 SPI N1provides one SPI interface which supports only the host mode The maximum rate is 52MHz and the reference level is 1 8V Figure 6 7 shows th...

Страница 55: ...motor driver interface and key backlight driver interface to meet the requirements for mobile device applications Motor is driven by specific circuit VIB_DRV_N connects to the negative pole of the mo...

Страница 56: ...nnector should have a 50 characteristic impedance and be as short as possible The trace should be surrounded by ground copper Place plenty of via holes to connect this ground copper to main ground pla...

Страница 57: ...e must have ultra low capacitance lower than 0 5 pF Otherwise it will affect the impedance of the RF loop or result in attenuation of RF signals RCLAMP0521P from Semtech or ESD5V3U1U from Infineon is...

Страница 58: ...Feeder 3 Pad of the matching circuit 4 50 transmission line calculated using Si9000 or APPCAD Number 5 in Figure 7 5 shows the area between the antenna and the ground Figure 7 6 shows the clearance if...

Страница 59: ...s through the feeder If the antenna and layout are not designed reasonably the GPS will be insensitive resulting in long time on positioning or inaccurate position Keep the GPRS and GPS far away from...

Страница 60: ...inside the module Do not use active GPS antenna with great gain Otherwise the GPS cannot work properly because of fullsignals 7 3 3 Passive GPS Antenna Design Reference If developersadopt a multiple l...

Страница 61: ...AMP0521P from Semtech or ESD5V3U1U from Infineon is recommended On the PCB keep the RF signals and RF components away from high speed circuits power supplies transformers inductors the clock circuit o...

Страница 62: ...adphone circuit with FM function 3 4 1 5 2 V V 10K 1000 25 100MHz 1000 25 100MHz 1000 25 100MHz 1000 25 100MHz 1000 25 100MHz 1000 25 100MHz V 10K 33pF 470pF AVL 5 5V 100PF AVL 5 5V 100PF AVL 5 5V 100...

Страница 63: ...fastboot mode by short connecting the FORCE_USB_BOOT pin and VDEBUG_L5_1P8 during the startup This is the last method to troubleshoot the abnormality that the module cannot start or operate properly...

Страница 64: ...he module ensure that it outputs at least 2 A current 9 2 Temperature Table 9 2 Temperature feature Temperature Minimum Value Typical Value Maximum Value Recommended 35 C 25 C 75 C Extended 40 C 85 C...

Страница 65: ...N1_Hardware_User_Guide Copyright Neoway Technology Co Ltd 57 Table 9 3 N1 ESD feature Testing Point Contact Discharge Air Discharge GND 6 kV 15 kV ANT 6 kV 15 kV Cover 6 kV 15 kV Others 4 kV 8 kV...

Страница 66: ...849MHz 869 894MHz TD SCDMA B34 2010 2025MHz 2010 2025MHz TD SCDMA B39 1880 1920MHz 1880 1920MHz LTE FDD B1 1920 1980MHz 2110 2170MHz LTE FDD B2 1850 1910MHz 1805 1880MHz LTE FDD B3 1710 1785MHz 1805 1...

Страница 67: ...emarks GPS 1575 42 1 023 MHz Fix position independently GLONASS 1597 5 1605 8 MHz Fix position independently BDS 1561 098 2 046 MHz Assist position fix 10 2 TX Power and RX Sensitivity Table 10 4 N1 R...

Страница 68: ...m 2 2dBm 95dBm LTE FDD B8 10MHz 23 dBm 2 2dBm 95dBm LTE FDD B17 10MHz 23 dBm 2 2dBm 95dBm LTE FDD B20 10MHz 23 dBm 2 2dBm 95dBm LTE FDD B38 10MHz 23 dBm 2 2dBm 97dBm LTE TDD B39 10MHz 23 dBm 2 2dBm 97...

Страница 69: ...th great opening adjust the temperature depending on the solder paste type 330 C for solder paste without lead 300 C for solder past with lead and heat the module till the solder paste is melt Then re...

Страница 70: ...Tone Multi Frequency DTR Data Terminal Ready EFR Enhanced Full Rate EGSM Enhanced GSM EMC Electromagnetic Compatibility EMI Electro Magnetic Interference ESD Electronic Static Discharge ETS European T...

Страница 71: ...Mean Square RTC Real Time Clock SIM Subscriber Identification Module SMS Short Message Service SRAM Static Random Access Memory TA Terminal adapter TDMA Time Division Multiple Access UART Universal as...

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