NI 9695 sbRIO Thermal Solution
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1.
Remove gap pad pieces from both liners and apply pink side to heat
spreader pads.
2.
Fasten heat spreader to mounting surface using provided 16 mm
standoffs. Tighten completely.
Note
Thermal interface material can optionally be used between heat spreader and
mounting surface. Note that thermal interface material may affect system stack height and
levelness.
3.
When mounting sbRIO-9623/9626, fasten provided 18 mm standoffs
to mounting surface in sbRIO footprint holes not used to fasten the heat
spreader. Tighten completely.
4.
Align sbRIO device to standoff holes and fasten using standoffs of the
proper height (not provided). See sbRIO manual for information on
selecting the proper standoff height. Use caution when aligning the
sbRIO device. Once it has been placed separating the heat spreader and
sbRIO device will be difficult and could potentially damage
components.
Caution
Do not
fasten screws using an automatic screwdriver. Gap pad is a viscoelastic
material and compressing it too fast will potentially break components by placing a large
amount of stress on them. It is recommended to fasten these screws at a rate below
10 in/min.
5.
Align RMC to standoff holes and mate RMC connectors. Fasten using
the provided screws.
Specifications
Physical Characteristics
Torque for screws ....................................0.56 N · m
(5 lb · in.)
Weight ....................................................118 g (4.16 oz)
Environmental
Note
Systems that use the heat spreader provided in NI 9695 are still required to validate
an sbRIO device per the specifications provided in the sbRIO device manual. Measure the
local ambient temperature by placing thermocouples on both sides of the PCB, 0.2 in.
(5 mm) from the board surface. In addition, the component temperatures should not exceed
their recommended maximum case temperatures. Systems that use the heat spreader
provided in NI-9695 have the option of only measuring the heat spreader temperature in
