NAT-AMC-ZYNQUP-FMC
T
ECHNICAL
R
EFERENCE
M
ANUAL
V1.1
S
PECIFICATIONS AND
C
OMPLIANCES
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8.
S
PECIFICATIONS AND
C
OMPLIANCES
8.1.
Internal Reference Documentation
•
For further documentation on
NAT-AMC-ZYNQUP-VISION
and
NAT-AMC-
ZYNQUP-SDR4/8
, please contact N.A.T.
8.2.
External Reference Documentation
•
Atmel ATxmega128 µC Product Datasheet, Rev A, 08/2018
•
Micron MT40A512M16LY-062 DDR4 SDRAM Datasheet, Rev. P, 04/2019
•
Xilinx Zynq Ult MPSoC DS891, V1.8, 10/2019
•
Xilinx Programming Module:
https://reference.digilentinc.com/reference/programmers/jtag-smt3/reference-
manual
8.3.
Standards Compliance
•
AMC.0 R2.0
•
AMC.1
•
AMC.2
•
AMC.3
•
AMC.4
•
IMPI V1.5
•
HPM.1
8.4.
Compliance to RoHS Directive
Directive 2011/65/EU of the European Parliament and of the Council of 8 June 2011 on the
"Restriction of the use of certain Hazardous Substances in Electrical and Electronic Equipment"
(RoHS) predicts that all electrical and electronic equipment being put on the European market
after June 30th, 2006 must contain lead, mercury, hexavalent chromium, poly-brominated
biphenyls (PBB) and poly-brominated diphenyl ethers (PBDE) and cadmium in maximum
concentration values of 0.1% respective 0.01% by weight in homogenous materials only.
As these hazardous substances are currently used with semiconductors, plastics (i.e. semi-
conductor packages, connectors) and soldering tin any hardware product is affected by the