SyChip/Murata Confidential Page 24 of 31 SN2100 Datasheet Ver. 1.1
9 Assembly
Information
9.1 Lead-free soldering reflow profile
The lead-free solder reflow profile is recommended in the table & graph below. The
profile is used to attach the module to its host PCB.
The module is designed to withstand 2 reflows. Opposite side reflow is prohibited due to
the module weight.
Table 10 Reflow Profile Recommendation
Ramp up rate
3
o
C/second max
Maximum time maintained above 217
o
C 120
seconds
Peak temperature
250
o
C
Maximum time within 5
o
C of peak temperature
20 seconds
Ramp down rate
6
o
C/second max
Reflow Profile
0
50
100
150
200
250
Time, seconds
T
e
m
p
er
atu
re
, C
Figure 11 Reflow Profile Pattern
