Notice
LLA
LLA
1.6
g
0.8
2.0
g
1.25
(in mm)
Chip (L
g
W)
Series
0.3 to 0.4
0.5 to 0.7
a
0.25 to 0.35
0.35 to 0.6
b
0.15 to 0.25
0.2 to 0.3
c
0.4
0.5
p
Table 4 LLA Series Reflow Soldering Method
18
21
[Land for ZRB Series]
Chip Dimension Code
(L/W)
ZRB
ZRB
1.0
g
0.5
1.6
g
0.8
(in mm)
Chip (L
g
W)
Series
0.4 to 0.6
0.7 to 0.9
a
0.4 to 0.5
0.7 to 0.8
b
0.5 to 0.7
0.8 to 1.0
c
Table 3 ZRB Series Reflow Soldering Method
15
18*
Chip Dimension
Code (L/W)
Solder Resist
a
b
c
ZRB
Land
*If distance between parts is too short, there is risk to cause
electrical short. Please confirm the mounting pitch
(distance between centers of parts) has 1.275mm or more.
(ZRB18 only)
Continued from the preceding page.
Continued on the following page.
GJM/GRM
GJM/GRM
GJM/GRM
GQM/GR3/GRJ/GRM
GQM
GR3/GRJ/GRM/GR7
GQM
GR3/GRJ/GRM/GR7
GR3/GRJ/GRM
GA2/GA3/GR4
GR3/GRJ/GRM/GA2/
GA3/GR4
GA2/GA3
GR3/GRJ/GRM/GA2/
GA3/GR4
LLL
LLL
LLL/LLR
LLL
LLL
0.4
g
0.2
0.6
g
0.3 (±0.03)
0.6
g
0.3 (±0.05)
0.6
g
0.3 (±0.09)
1.0
g
0.5 (within ±0.10)
1.0
g
0.5 (±0.15/±0.20)
1.6
g
0.8 (within ±0.10)
1.6
g
0.8 (±0.15/±0.20)
2.0
g
1.25
2.0×
g
1.25 (within ±0.10)
2.0
g
1.25 (±0.15)
2.0
g
1.25 (±0.20)
2.8
g
2.8
3.2
g
1.6 (within ±0.20)
3.2
g
1.6 (±0.30)
3.2
g
2.5
4.5
g
2.0
4.5
g
3.2
5.7
g
2.8
5.7
g
5.0
0.5
g
1.0
0.6
g
1.0
0.8
g
1.6
1.25
g
2.0
1.6
g
3.2
0.16 to 0.2
0.2 to 0.25
0.2 to 0.25
0.23 to 0.3
0.3 to 0.5
0.4 to 0.6
0.6 to 0.8
0.7 to 0.9
1.0 to 1.2
1.2
1.2
1.0 to 1.4
2.2 to 2.5
1.8 to 2.0
1.9 to 2.1
2.0 to 2.4
2.8 to 3.4
3.0 to 3.5
4.0 to 4.6
4.0 to 4.6
0.15 to 0.2
0.20 to 0.25
0.2 to 0.3
0.4 to 0.5
0.6 to 0.8
0.12 to 0.18
0.2 to 0.3
0.25 to 0.35
0.25 to 0.35
0.35 to 0.45
0.4 to 0.5
0.6 to 0.7
0.7 to 0.8
0.6 to 0.7
0.6
0.6 to 0.8
0.6 to 0.8
0.8 to 1.0
0.9 to 1.2
1.0 to 1.3
1.0 to 1.2
1.2 to 1.4
1.2 to 1.4
1.4 to 1.6
1.4 to 1.6
0.2 to 0.25
0.25 to 0.35
0.3 to 0.4
0.4 to 0.5
0.6 to 0.7
0.2 to 0.23
0.25 to 0.35
0.3 to 0.4
0.3 to 0.4
0.4 to 0.6
0.5 to 0.7
0.6 to 0.8
0.8 to 1.0
0.8 to 1.1
1.25
1.2 to 1.4
1.2 to 1.4
1.9 to 2.3
1.5 to 1.7
1.7 to 1.9
1.8 to 2.3
1.4 to 1.8
2.3 to 3.0
2.1 to 2.6
3.5 to 4.8
0.7 to 1.0
0.7 to 1.0
1.4 to 1.6
1.4 to 1.8
2.6 to 2.8
KRM
KRM
KR3/KRM
2.0
g
1.25
3.2
g
1.6
5.7
g
5.0
1.0 to 1.2
2.2 to 2.4
2.6
0.6 to 0.7
0.8 to 0.9
2.7
0.8 to 1.1
1.0 to 1.4
5.6
(in mm)
Chip (L
g
W)
a
b
c
<Applicable to Part Number KR3/KRM>
(in mm)
Chip (L
g
W)
Series
Series
02
03
15
18
21
21
22
31
32
42
43
52
55
15
1U
18
21
31
21
31
55
Chip Dimension Code
(L/W)
Chip Dimension Code
(L/W)
a
b
c
Table 2 Reflow Soldering Method
!
Note
• Please read rating and
!
CAUTION (for storage, operating, rating, soldering, mounting and handling) in this catalog to prevent smoking and/or burning, etc.
• This catalog has only typical specifications. Therefore, please approve our product specifications or transact the approval sheet for product specifications before ordering.