9-6
MPC180E Security Processor User’s Manual
PRELIMINARY—SUBJECT TO CHANGE WITHOUT NOTICE
Case Outline Package Dimensions
9.8 Case Outline Package Dimensions
Figure 9-2. Case Outline Package Dimensions
ÇÇÇ
ÇÇÇ
ÉÉ
ÉÉ
DIM
A
MIN
MAX
14.00 BSC
MILLIMETERS
A1
7.00 BSC
B
14.00 BSC
B1
7.00 BSC
C
1.70
C1
0.05
0.20
C2
1.30
1.50
D
0.10
0.30
E
0.45
0.75
F
0.15
0.23
G
0.50 BSC
J
0.07
0.20
K
0.50 REF
R1
0.08
0.20
S
16.00 BSC
S1
8.00 BSC
U
0.09
0.16
V
16.00 BSC
V1
8.00 BSC
W
0.20 REF
Z
1.00 REF
q
0 7
q
0
q
12 REF
q
NOTES:
1. DIMENSIONS AND TOLERANCES PER ASME
Y14.5M, 1994.
2. DIMENSIONS IN MILLIMETERS.
3. DATUMS L, M AND N TO BE DETERMINED AT THE
SEATING PLANE, DATUM T.
4. DIMENSIONS S AND V TO BE DETERMINED AT
SEATING PLANE, DATUM T.
5. DIMENSIONS A AND B DO NOT INCLUDE MOLD
PROTRUSION. ALLOWABLE PROTRUSION IS 0.25
PER SIDE. DIMENSIONS A AND B INCLUDE MOLD
MISMATCH.
6. DIMENSION D DOES NOT INCLUDE DAMBAR
PROTRUSION. DAMBAR PROTRUSION SHALL
NOT CAUSE THE LEAD WIDTH TO EXCEED 0.35.
MINIMUM SPACE BETWEEN PROTRUSION AND
ADJACENT LEAD OR PROTRUSION 0.07.
1
2
3
_
_
_
_
VIEW Y
4X 25 TIPS
4X
25
100
76
75
51
26
50
1
VIEW AA
C
N
0.2 T L–M
0.08 T
C2
C1
(K)
(Z)
(W)
GAGE PLANE
VIEW AA
VIEW Y
AB
PLATING
U
J
D
F
ROTATED 90 CLOCKWISE
BASE METAL
SECTION AB–AB
0.05
E
0.25
CL
L–M
M
0.08
N
T
3X
3
q
4X
1
q
2X R
R1
q
X = L, M OR N
G
_
A
S
A1
S1
B1
V1
B
V
–––
–––
N
0.2 T L–M
M
N
T
SEATING
2
q
4X
100X
PLANE
X
AB
L
12 REF
_
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Freescale Semiconductor, Inc.
For More Information On This Product,
Go to: www.freescale.com
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Freescale Semiconductor, Inc.
For More Information On This Product,
Go to: www.freescale.com
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