1-2
Introduction
2.
Cleaning Internal Circuit Boards and Components
Isopropyl alcohol may be applied with a stiff, non-metallic, short-bristled brush to dislodge
embedded or caked materials located in hard-to-reach areas. The brush stroke should
direct the dislodged material out and away from the inside of the radio. Make sure that
controls or tunable components are not soaked with alcohol. Do not use high-pressure
air to hasten the drying process since this could cause the liquid to collect in unwanted
places. Upon completion of the cleaning process, use a soft, absorbent, lintless cloth to
dry the area. Do not brush or apply any isopropyl alcohol to the frame, front cover, or
back cover.
1.4
Safe Handling of CMOS and LDMOS
Complementary metal-oxide semiconductor (CMOS) devices are used in this family of radios.
CMOS characteristics make them susceptible to damage by electrostatic or high voltage charges.
Damage can be latent, resulting in failures occurring weeks or months later. Therefore, special
precautions must be taken to prevent device damage during disassembly, troubleshooting, and
repair.
Handling precautions are mandatory for CMOS circuits and are especially important in low
humidity conditions. DO NOT attempt to disassemble the radio without first referring to the CMOS
CAUTION paragraph in the Disassembly and Reassembly section of the manual.
1.5
General Repair Procedures and Techniques
NOTE
Always use a fresh supply of alcohol and a clean container to prevent contamination by
dissolved material (from previous usage).
NOTE
Environmentally Preferred Products (EPP) (refer to the marking on the printed circuit
boards - examples shown below) were developed and assembled using environmentally
preferred components and solder assembly techniques that meet or exceed compliance
to the European Union’s ROHS and WEEE directives
(Waste Electrical and Electronic
Equipment (WEEE) Directive 2002/96/EC
and
Restriction of Hazardous Subtances
(ROHS) Directive 2002/95/EC).
To maintain product compliance and reliability, use only
the Motorola specified parts in this manual.
For the identification of lead (Pb) free assemblies, all EPP products will carry the EPP
Marking, shown below, on the printed circuit board (PCB). This marking provides
information to those performing assembly, servicing and recycling operation on this
product, adhering to the JEDEC standard #97. The EPP Marking takes the form of a
label or marking on the PCB.
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