Miele IR 6002, Руководство по эксплуатации

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Bottom basket U 500
Large quantities of small boards can be
processed using inserts such as the
E 402 or E 403 in conjunction with an
E 439. Lightweight or sensitive circuit
boards should be protected with a cover
net or grille.
Soldering frames
Depending on the type of soiling (adipic
acid, colophonium etc.) cleaning should
be carried out using an alkaline cleaning
agent (0.3 - 0.5% at 50 - 75 °C, process
1 or 2, see "Description of the machine -
Water recovery") or a special cleaning
agent (1 - 3% at 50 - 75 °C, process 3,
see "Description of the machine - Water
recovery"). If the rinse water or the
special cleaning agent is to be re-used
a buffer or recycling tank is required.
Depending on the type of material used
to manufacture the soldering frames it
may be necessary to use an acidic
neutralising agent (0.1 - 0.2%) or a
rinsing agent (0.05 - 0.1%).
Carrying out the final rinse on
aluminium soldering frames with fully
demeralised water will help to prevent
any material damage that might be
caused by the quality of the mains
water.
Example: 8 soldering frames approx.
475 mm x 430 mm x 45 - 50 mm (length
x width x thickness) can be cleaned
and dried in this machine in a batch
time of 30 minutes, if the machine is
connected to a 65 °C hot water supply.
Loading example:
Bottom basket U 874 with insert E 500
Insert E 500
Areas of application
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