Microchip Technology SA5 Series, Руководство пользователя

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MAC-SA5X USER’S GUIDE
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2019 Microchip Technology Inc. DS50002938A-page 15
Chapter 2. Installation
2.1 HANDLING CONSIDERATIONS
CAUTION
To avoid electrostatic discharge (ESD) damage, proper ESD handling procedures must
be observed in unpacking, assembling, and testing the MAC.
The MAC is delivered in ESD-safe packaging. The MAC must be removed from the
ESD-protective bag in an ESD-safe environment. Once installed on the test fixture, it
is recommended that the entire assembly be treated as ESD-sensitive.
Retain the original MAC ESD-safe packaging material in the event that the device
needs to be returned to Microchip for service.
2.2 MOUNTING CONSIDERATIONS
For initial testing and evaluation, it is recommended that the pins not be modified or sol-
dered to a PCB. The recommended socket for PCB attachment is Mill-Max
0332-0-43-80-18-27-10-0. After evaluation, the pins can be hand-soldered to a PCB.
Below is the mechanical drawing (ICD). Contact Microchip for latest revision.
FIGURE 2-1: ICD 697-00498-000 for MAC.