Microchip Technology MCP401XEV, Руководство пользователя

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MCP401XEV Evaluation Board User’s Guide
DS51888A-page 16
©
2010 Microchip Technology Inc.
TABLE 2-1: INSTALLED PASSIVE COMPONENTS
(2)
Component Description Comment
R1U, R8U 0
Ω
SMT 805 Pull-up resistor
R2D 0
Ω
SMT 805 Pull-down resistor
(1)
U1 MCP40D18-103AE/LT 10 k
Ω
, Device I
2
C Slave Address = 7Ch
P7 Test Point - through hole connector
(Orange)
J1 1x6 Male Header, 100 mil spacing
90° angle. 1 x 6 male Header
—
Blue Wire:
J1 SCL via to P3 via
J1 SDA via to P6 via
See
Figure 2-2
Note 1: Whichever pin is the device’s VDD pin, that corresponding RXD footprint can be used for the device’s
bypass capacitor. So if Pin 8 is the device’s VDD pin, then install the bypass capacitor in the R8D
footprint.
2: All passive components use the surface mount 805 footprint.
TABLE 2-2: OPTIONAL PASSIVE COMPONENTS - NOT INSTALLED
(2)
Component Comment
C1, C2 Power supply bypass capacitors
(3)
R2U, R3U, R4U, R5U, R6U, R7U Pull-up resistor
R1D, R3D, R4D, R5D, R6D, R7D, R8D Pull-down resistor
(1)
U2, U3, U4 Alternate package footprints
VDD, GND Power and Ground plane connection points
P1, P2, P3, P4, P5, P6, P8 Test Point connectors
Note 1: Whichever pin is the device’s VDD pin, that corresponding RXD footprint can be used for the device’s
bypass capacitor. So if Pin 8 is the device’s VDD pin, then install the bypass capacitor in the R8D footprint.
2: All passive components use the surface mount 805 footprint.
3: If board is powered via the VDD and GND connection points, the use of bypass capacitors on C1 and C2
may improve performance. The benefit is reduced if the board is powered via the PICkit Serial interface.