EVBPCBA Documentation
2013 Microchip Technology Inc.
DS00001574A-page 19
J36
Bond 0 Configuration
Header
1 --- 2
2 --- 3
Pulled high to VDD33 (default)
Pulled down to GND
J37
Bond 1 Configuration
Header
1 --- 2
2 --- 3
Pulled high to VDD33 (default)
Pulled down to GND
J38
Bond 2 Configuration
Header
1 --- 2
2 --- 3
Pulled high to VDD33
Pulled down to GND (default) for OTP / ROM execution
J19
Smart Card 1 (SC1 I/F –
Credit Card)
10
9
8
4
7
3
6
2
5
1
CDSW2 (GND)
SC1_PRSNT#
SC1_C8
SC1_C4
SC1_IO
SC1_CLK
NC
SC1_RST#
GND
SC1_VCC
J25
Smart Card 2 (SC2 I/F –
Credit Card)
10
9
8
4
7
3
6
2
5
1
CDSW2 (GND)
SC2_PRSNT#
NC
NC
SC2_IO
SC2_CLK
NC
SC2_RST#
GND
SC2_VCC
J39
DUT EDP/EDP-T JTAG
Header
2,6,10,16
1,3,4,5,7,9
,11,13,15,
17,19,20
8
12
14
18
nc pins
GND Test Points
TCK (JTAG_CLK)
TDO (PJTAG_TDO)
TDI (PJTAG_TDI)
TMS (PJTAG_TMS)
J40
General purpose pull up
to 3.3V thru 1K ohm
resistor
1-4
Open (default)
Connector
Description
Settings
