Figure 7-2. Reflow Profile Example used for Soldering ATSAMA5D27-WLSOM1 Module on ATSAMA5D27-
WLSOM1-EK1 Board
IPC-020e-5-1
T
c
-5°C
t
Max. Ramp Up Rate = 3°C/s
Max. Ramp Down Rate = 6°C/s
Preheat Area
T
smax
T
smin
t
s
T
p
T
L
T
e
m
p
e
r
a
t
u
r
e
Time
25
Time 25°C to Peak
Supplier Tp > Tc
-
Supplier tp
Tc
User Tp < Tc
-
User tp
Tc -5°C
t
p
L
Table 7-1. Reflow Profile Table Parameters
Profile Feature
J-STD-020E Profile
Pre-heat Temperature Min
T
smin
150°C
Pre-heat Temperature Max
T
smax
200°C
Temperature Rise
ts (from T
smin
to T
smax
)
60 to 120 seconds
Ramp-up Rate
T
L
to T
p
3°C/sec. max.
Liquidous Temperature Time maintained above 217°C
t
L
60 to 150 seconds
Peak Temperature
T
P
245°C
Time (t
P
) within 5°C of the specified classification temperature (T
C
)
t
P
30 seconds
Ramp-down rate
T
P
to T
L
6°C/sec. max.
Time 25°C to peak temperature
–
8 minutes max.
SAMA5D27 Wireless SOM1
Assembly and Storage Information
©
2021 Microchip Technology Inc.
and its subsidiaries
Complete Datasheet
DS60001590D-page 58
