3.1 Device Mounting Instructions
Ineffective heat sinking may lead to premature LED degradation or failure. The following steps explain how a device is mounted on the
heat sink while ensuring good thermal contact between the copper core-board and the heat sink:
1. Use a thermal interface sheet that is slightly larger than the core-board (Figure 7).
Figure 8: PT-39 LED and an appropriate TIM sheet
2. The heat sink surface must be free of dust particles. Place the thermal interface sheet on the heat sink with its pre-drilled holes matching
the holes on the heat sink .
3. Place the device on the thermal interface sheet.
4. Insert screws in the holes of the coreboard and tighten. To ensure equal pressure is exerted by all screws, alternate tightening each screw
until the board is securely fastened. The device is now mounted and ready for electrical connections (Figure 9).
Figure 9: LED mounted on heat sink
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DK-114N series - Development Kit Manual
Table 1: Additional Lab Equipment
Lab Equipment
Model
12 V Lab Power Supply
Lambda ZUP20-20
Oscilloscope
Tektronix TDS 3024B
Waveform Generator
Agilent 33220A
Multimeter
Fluke 187
Photodetector
Thorlabs PDA10A
