LSI Logic Confidential
18-70
Specifications
Copyright © 2001, 2002 by LSI Logic Corporation. All rights reserved.
18.4 Package Mechanical Specifications
This section provides the dimensions and recommended manufacturing
conditions for the DMN-8600 processor.
18.4.1 Package Dimensions
The DMN-8600 processor is available in a 308-pin ball grid array (BGA)
package illustrated in
.
Содержание DMN-8600
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