LSI Logic Confidential
Package Mechanical Specifications
18-71
Copyright © 2001, 2002 by LSI Logic Corporation. All rights reserved.
Figure 18.45 308-Pin BGA Package Mechanical Dimensions
Pin A1 Indicators
Bottom View
Top View
1 2 3 4 5 6 7 8 9 10 11 12 13 14 15 16 17 18 19 20
Y
W
V
U
T
R
P
N
M
L
K
J
H
G
F
E
D
C
B
A
D1
E1
e
e
b
E
E2
D3
D2
D
E3
Dimensions in mm
Dimensions in inches
Symbol
Min.
Nom.
Max.
Min.
Nom.
Max.
A
2.20
2.33
2.50
0.087
0.092
0.098
A1
–
0.60
–
–
0.024
–
A2
1.12
1.17
1.22
0.044
0.046
0.048
b
–
0.75
–
–
0.030
–
c
0.51
0.56
0.61
0.020
0.022
0.024
D
26.80
27.00
27.20
1.055
1.063
1.071
D1
–
24.13
–
–
0.950
–
D2
23.80
24.00
24.20
0.937
0.945
0.953
D3
17.95
18.00
18.05
0.707
0.709
0.711
E
26.80
27.00
27.20
1.055
1.063
1.071
E1
–
24.13
–
–
0.950
–
E2
23.80
24.00
24.20
0.937
0.945
0.953
E3
17.95
18.00
18.05
0.707
0.709
0.711
e
–
1.27
–
–
0.050
–
ddd
–
–
0.15
–
–
0.006
q
30˚ Typ
30˚ Typ
1. The metric (millimeter) values are the controlling dimensions and
should be used for PC board design.
2. Dimension b is measured at the maximum solder ball diameter.
3. Minimum clearance of 0.25 mm between the edge of the
solder ball and the body edge.
A2
A
ddd
A1
c
q
Important:
This drawing may not be the latest version.
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