LT3480
23
3480fb
PACKAGE DESCRIPTION
MSE Package
10-Lead Plastic MSOP
(Reference LTC DWG # 05-08-1660)
MSOP (MSE) 0307 REV B
0.53
p
0.152
(.021
p
.006)
SEATING
PLANE
0.18
(.007)
1.10
(.043)
MAX
0.17 – 0.27
(.007 – .011)
TYP
0.86
(.034)
REF
0.50
(.0197)
BSC
1 2 3 4 5
4.90
p
0.152
(.193
p
.006)
0.497
p
0.076
(.0196
p
.003)
REF
8
9
10
10
1
7 6
3.00
p
0.102
(.118
p
.004)
(NOTE 3)
3.00
p
0.102
(.118
p
.004)
(NOTE 4)
NOTE:
1. DIMENSIONS IN MILLIMETER/(INCH)
2. DRAWING NOT TO SCALE
3. DIMENSION DOES NOT INCLUDE MOLD FLASH, PROTRUSIONS OR GATE BURRS.
MOLD FLASH, PROTRUSIONS OR GATE BURRS SHALL NOT EXCEED 0.152mm (.006") PER SIDE
4. DIMENSION DOES NOT INCLUDE INTERLEAD FLASH OR PROTRUSIONS.
INTERLEAD FLASH OR PROTRUSIONS SHALL NOT EXCEED 0.152mm (.006") PER SIDE
5. LEAD COPLANARITY (BOTTOM OF LEADS AFTER FORMING) SHALL BE 0.102mm (.004") MAX
0.254
(.010)
0
o
– 6
o
TYP
DETAIL “A”
DETAIL “A”
GAUGE PLANE
5.23
(.206)
MIN
3.20 – 3.45
(.126 – .136)
0.889
p
0.127
(.035
p
.005)
RECOMMENDED SOLDER PAD LAYOUT
0.305
p
0.038
(.0120
p
.0015)
TYP
2.083
p
0.102
(.082
p
.004)
2.794
p
0.102
(.110
p
.004)
0.50
(.0197)
BSC
BOTTOM VIEW OF
EXPOSED PAD OPTION
1.83
p
0.102
(.072
p
.004)
2.06
p
0.102
(.081
p
.004)
0.1016
p
0.0508
(.004
p
.002)
