3. TECHNICAL BRIEF
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3.3. Power management IC
3.3.1. General Description
SM-POWER is a highly integrated Power and Battery Management IC for mobile handsets. It has
been specially designed for usage with S-Gold2. Although optimized for usage with the Infineon S-
GOLD baseband device it is suitable for the S-GOLDlite and the E-GOLD+ baseband devices as
well. It also supports the cellular RF devices like SMARTi-DC, SMARTi-DC+, SMARTi-SD and the
Bluemoon Single, Infineon’s single chip solution for Bluetooth. If used with S-GOLD2 it provides all
power supply functions (except for the RF PA) for a complete advanced GSM Edge smart phone
minimizing external device count.
Block Description
• Highly efficient step-down converter for main digital baseband supply including Core, DSP and
memory interface (External Bus Unit).
• Support of S-GOLD standby power-down concept
• Low-drop-out (LDO) regulators for Flash and mobile RAM memory devices
• Voltage independent switching of two SIM cards
• LDO regulators for baseband I/O supply
• LDO regulator for analog mixed-signal section of S-GOLD
• Low-noise LDO regulators for RF devices
• Supply for Bluemoon Single, Infineon’s single chip solution for Bluetooth
• Audio amplifier 8 Ohms for handsfree operation and ringing
• Charge Control for charging Li-Ion/Polymer batteries under software control
• Pre-charge current generator with selectable current level
• RTC regulator with ultra-low quiescent current
• USB interface support for peripheral and mini-host mode
• Backlight LEDs driver with current selection and PWM dimming function
F32K
to 32k crystal
OSC32K
to 32k crystal
RESET_n RESETn
CC1CC1IO
TRIG_OUT
For JTAG & ETM Interface
RTC_OUT
RTC_OUT
VCXO_EN XO_ENE
CLKOUT0
26M_DAC
For Audio AMP
GPIO_62
BT_RST
For Bluetooth
GPIO_63 SIM_EN_n
Содержание Prada KE850
Страница 1: ...Date March 2007 Issue 1 0 Service Manual Model KE850 Service Manual KE850 ...
Страница 3: ... 4 ...
Страница 5: ... 6 ...
Страница 70: ...4 PCB layout 71 4 PCB layout 4 1 Main Sub PCB component placement Main PCB Top Main PCB Top placement ...
Страница 71: ...4 PCB layout 72 Main PCB bottom Main PCB bottom placement ...
Страница 115: ... 116 6 Download S W upgrade 6 Press the START button ...
Страница 116: ... 117 6 Download S W upgrade 7 Stand by condition Wait is displayed connect the Phone KE850 KE850P40 7 V09a ...
Страница 117: ...6 Download S W upgrade 118 KE850 KE850P40 7 V09a KE850 KE850P40 7 V09a ...
Страница 127: ... 128 LGMC 8 pcb layout ...
Страница 128: ... 129 LGMC 8 pcb layout ...
Страница 129: ... 130 LGMC 8 pcb layout ...
Страница 130: ... 131 LGMC 8 pcb layout ...
Страница 131: ... 132 8 pcb layout ...
Страница 132: ... 133 8 pcb layout ...
Страница 133: ... 134 8 pcb layout ...
Страница 134: ... 135 8 pcb layout ...
Страница 135: ... 136 8 pcb layout ...
Страница 136: ... 137 8 pcb layout ...
Страница 137: ... 138 ...
Страница 139: ...9 RF Calibration 140 9 2 3 Click SETTING Menu 9 2 4 Setup Ezlooks menu such as the following figure ...
Страница 141: ...9 RF Calibration 142 9 2 7 Select MODEL 9 2 8 Click START for RF calibration 9 2 9 RF Calibration finishes ...
Страница 142: ...9 RF Calibration 143 9 2 10 Calibration data will be saved to the following folder Saving format year month day PASS ...
Страница 149: ... 150 ...
Страница 151: ... 152 ...
Страница 172: ...Note ...
Страница 173: ...Note ...