12. EXPLODED VIEW & REPLACEMENT PART LIST
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Copyright © 011 LG Electronics. Inc. All right reserved.
Only for training and service purposes
LGE Internal Use Only
Level
Location No.
Description
PartNumber
Spec
Remark
5
ABM01
Can Assembly,
Shield
ABM73616201
LGE730.AORUTN ZZ:Without Color SUS 0.15T
6
R235
Resistor, Chip
ERHY0000193
RC1005F270CS 27OHM 1% 1/16W 1005 R/TP -
SAMSUNG ELECTRO-MECHANICS CO., LTD.
6
FB902
Inductor, Multilayer,
Chip
ELCH0004720
1005GC2T1N2SLF 1.2NH 0.3NH - 300mA 0.12OHM
9GHZ 8 SHIELD NONE 1.0X0.5X0.5MM R/TP
PILKOR ELECTRONICS LTD.
6
C907,
C908
Capacitor, Ceramic,
Chip
ECZH0001122
C1005X7R1H681KT000F 680pF 10% 50V X7R -
55TO+125C 1005 R/TP - TDK KOREA
COOPERATION
6
U200
IC, MCP, eMMC
EAN62131501
H26M21001ECR 2GBYTE 2.7VTO3.6V,
1.7VTO1.95V 11.5x13.0x1.2 TR 153P MLC NAND
FBGA 2GB eMMC v4.41 (32nm 16Gb MLC NAND)
HYNIX SEMICONDOCTOR
6
R200,
R201,
R202,
R203,
R204,
R205,
R206,
R207,
R208,
R216,
R221,
R426,
R808
Resistor, Chip
ERHY0009505
MCR006YZPJ103 10KOHM 5% 1/20W 0603 R/TP -
ROHM.
6
C410,
C700,
C712
Capacitor, Ceramic,
Chip
ECCH0009106
C0603X7R1C103KT 10nF 10% 10V X7R -
55TO+125C 0603 R/TP - TDK CORPORATION
6
Q700
TR, Bipolar
EQBN0012401
KRC402E NPN 30V 0V 50V 100mA 500mA 50
100mW ESM R/TP 3P KEC CORPORAITION