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Copyright © 2009 LG Electronics. Inc. All right reserved.
Only for training and service purposes
LGE Internal Use Only
3. BB Circuit Technical brief
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2008 LG Electronics. Inc. All right reserved.
Only for training and service purposes
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3G Coprocessor Subsystem
- ARM7 TRMI-S
· 240 kByte Instruction RAM
· 64 kByte Data RAM
· 8 kByte Boot ROM
- 20kByte Communication RAM
- HW accelerators for
· Transmit Path
· Inner and Outer Receiver for Release5 incl. HSDPA
3.2.3 RF Interface(T_OUT)
S-Gold® 3H uses this interface to control RF IC and Peripherals.
[Table 3.2.3-1] RF Interface Spec.
T_OUT
Resource
Interconnection
Description
T_OUT0
TXON_PA
PAM Power on
T_OUT1
NA
-
T_OUT2
ANT_SEL1
T_OUT3
HOOK_DETECT
T_OUT4
_CHG_EOC
T_OUT5
JACK_DETECT
T_OUT6
PA_MODE
PAM Mode select
T_OUT7
ANT_SEL2
T_OUT8
ANT_SEL3
T_OUT9
KEY_BACK_EN
T_OUT10
DSR
T_IN0
LCD_BL_CTRL
T_IN1
CHG_EN
Содержание KM555
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