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- 5 -

SERVICING PRECAUTIONS

CAUTION:

Before servicing receivers covered by this

service manual and its supplements and addenda, read
and follow the 

SAFETY PRECAUTIONS

on page 3 of this

publication.

NOTE:

If unforeseen circumstances create conflict

between the following servicing precautions and any of the
safety precautions on page 3 of this publication, always
follow the safety precautions. Remember: Safety First.

General Servicing Precautions

1. Always unplug the receiver AC power cord from the AC

power source before;
a. Removing or reinstalling any component, circuit

board module or any other receiver assembly.

b. Disconnecting or reconnecting any receiver electrical

plug or other electrical connection.

c. Connecting a test substitute in parallel with an

electrolytic capacitor in the receiver.

CAUTION:

A wrong part substitution or incorrect

polarity installation of electrolytic capacitors may
result in an explosion hazard.

d. Discharging the picture tube anode.

2. Test high voltage only by measuring it with an

appropriate high voltage meter or other voltage
measuring device (DVM, FETVOM, etc) equipped with
a suitable high voltage probe.
Do not test high voltage by "drawing an arc".

3. Discharge the picture tube anode only by (a) first

connecting one end of an insulated clip lead to the
degaussing or kine aquadag grounding system shield
at the point where the picture tube socket ground lead
is connected, and then (b) touch the other end of the
insulated clip lead to the picture tube anode button,
using an insulating handle to avoid personal contact
with high voltage.

4. Do not spray chemicals on or near this receiver or any

of its assemblies.

5. Unless specified otherwise in this service manual,

clean electrical contacts only by applying the following
mixture to the contacts with a pipe cleaner, cotton-
tipped stick or comparable non-abrasive applicator;
10% (by volume) Acetone and 90% (by volume)
isopropyl alcohol (90%-99% strength)

CAUTION:

This is a flammable mixture.

Unless specified otherwise in this service manual,
lubrication of contacts in not required.

6. Do not defeat any plug/socket B+ voltage interlocks

with which receivers covered by this service manual
might be equipped.

7. Do not apply AC power to this instrument and/or any of

its electrical assemblies unless all solid-state device
heat sinks are correctly installed.

8. Always connect the test receiver ground lead to the

receiver chassis ground before connecting the test
receiver positive lead.
Always remove the test receiver ground lead last.

9. 

Use with this receiver only the test fixtures specified in
this service manual.

CAUTION:

Do not connect the test fixture ground strap

to any heat sink in this receiver.

Electrostatically Sensitive (ES) Devices

Some semiconductor (solid-state) devices can be
damaged easily by static electricity. Such components
commonly are called 

Electrostatically Sensitive (ES)

Devices.

Examples of typical ES devices are integrated

circuits and some field-effect transistors and
semiconductor "chip" components. The following
techniques should be used to help reduce the incidence of
component damage caused by static by static electricity.
1. Immediately before handling any semiconductor

component or semiconductor-equipped assembly, drain
off any electrostatic charge on your body by touching a
known earth ground. Alternatively, obtain and wear a
commercially available discharging wrist strap device,
which should be removed to prevent potential shock
reasons prior to applying power to the unit under test.

2. After removing an electrical assembly equipped with

ES devices, place the assembly on a conductive
surface such as aluminum foil, to prevent electrostatic
charge buildup or exposure of the assembly.

3. Use only a grounded-tip soldering iron to solder or

unsolder ES devices.

4. Use only an anti-static type solder removal device.

Some solder removal devices not classified as "anti-
static" can generate electrical charges sufficient to
damage ES devices.

5. Do not use freon-propelled chemicals. These can

generate electrical charges sufficient to damage ES
devices.

6. Do not remove a replacement ES device from its

protective package until immediately before you are
ready to install it. (Most replacement ES devices are
packaged with leads electrically shorted together by
conductive foam, aluminum foil or comparable
conductive material).

7. Immediately before removing the protective material

from the leads of a replacement ES device, touch the
protective material to the chassis or circuit assembly
into which the device will be installed.

CAUTION: 

Be sure no power is applied to the chassis

or circuit, and observe all other safety precautions.

8. Minimize bodily motions when handling unpackaged

replacement ES devices. (Otherwise harmless motion
such as the brushing together of your clothes fabric or
the lifting  of your foot from a carpeted floor can
generate static electricity sufficient to damage an ES
device.)

Содержание Flatron L226WTQ

Страница 1: ... Website http biz LGservice com CAUTION BEFORE SERVICING THE UNIT READ THE SAFETY PRECAUTIONS IN THIS MANUAL CHASSIS NO LM74B MODEL L226WTQ L226WTQ BFS A MQP A QQP A VQP L226WTQ L226WTQ WFS A OAP A QAP A VAP Same model for Service ...

Страница 2: ...efer to the Timing Chart 3 1 Sync Signal Type Separate Sync SOG Digital 3 2 Video Input Signal 1 Type R G B Analog 2 Voltage Level 0 0 7 V 3 Input Impedance 75 Ω 3 3 Operating Frequency Horizontal 28 83kHz Vertical 56 75Hz 4 MAX RESOLUTION Analog 1680 x 1050 60Hz Digital 1680 x 1050 60Hz 5 POWER SUPPLY 5 1 Power Adaptor Built in Power Input AC 100 240V 50 60Hz 1 2A 5 2 Power Consumption 6 ENVIRONM...

Страница 3: ...c T M D S Data1 T M D S Data1 T M D S Data1 3 Shield T M D S Data3 T M D S Data3 5V Power Ground return for 5V H Sync and V Sync Pin Signal DVI D 1 8 9 17 24 16 16 17 18 19 20 21 22 23 24 Hot Plug Detect T M D S Data0 T M D S Data0 T M D S Data0 5 Shield T M D S Data5 T M D S Data5 T M D S Clock Shield T M D S Clock T M D S Clock T M D S Transition Minimized Differential Signaling DVI D Connector ...

Страница 4: ...e module from the ESD as it may damage the electronic circuit C MOS Make certain that treatment person s body are grounded through wrist band Do not leave the module in high temperature and in areas of high humidity for a long time The module not be exposed to the direct sunlight Avoid contact with water as it may a short circuit within the module If the surface of panel become dirty please wipe i...

Страница 5: ...st receiver ground lead to the receiver chassis ground before connecting the test receiver positive lead Always remove the test receiver ground lead last 9 Use with this receiver only the test fixtures specified in this service manual CAUTION Do not connect the test fixture ground strap to any heat sink in this receiver Electrostatically Sensitive ES Devices Some semiconductor solid state devices ...

Страница 6: ...tip as the solder melts 2 Draw away the melted solder with an anti static suction type solder removal device or with solder braid before removing the IC Replacement 1 Carefully insert the replacement IC in the circuit board 2 Carefully bend each IC lead against the circuit foil pad and solder it 3 Clean the soldered areas with a small wire bristle brush It is not necessary to reapply acrylic coati...

Страница 7: ...onnection 4 Route the jumper wire along the path of the out away copper pattern and let it overlap the previously scraped end of the good copper pattern Solder the overlapped area and clip off any excess jumper wire At Other Connections Use the following technique to repair the defective copper pattern at connections other than IC Pins This technique involves the installation of a jumper wire on t...

Страница 8: ...x 768 V Lines 60 0 806 768 3 6 29 7 H Pixels 78 75 60 123 1312 1024 16 96 176 1024 x 768 V Lines 75 029 800 768 1 3 28 8 H Pixels 108 0 67 500 1600 1152 64 128 256 1152 x 864 V Lines 75 000 900 864 1 3 32 9 H Pixels 108 0 63 981 1688 1280 48 112 248 1280 x 1024 V Lines 60 02 1066 1024 1 3 38 10 H Pixels 135 0 79 976 1688 1280 16 144 248 1280 x 1024 V Lines 75 035 1066 1024 1 3 38 11 H Pixels 119 6...

Страница 9: ...Remove the screws 1 Remove the screws 1 Disassemble PCB 2 Put the front face down Disassemble PCB 2 3 4 5 6 Disassemble back cover 1 Pull the front cover upward 2 Then let the all latches are separated with jig 3 4 7 ...

Страница 10: ...s 15V DVI D DVI TMDS KEY 1 8V 1 8V Module SDA SCL EEPROM EDID EEPROM System 3 3V EEPROM EDID 1680X1050 60Hz 146Mhz Dual Interface Engine Display Processing Engine Response Time Enhancement LVDS Panel Interface OSD Clock Generator MCU DRAM TSUMO58CWHJ Flash ROM 3 3V Crystal 14 318MHz BLOCK DIAGRAM ...

Страница 11: ...G resolution signal and outputs 8 bit R G B signal to transmitter 2 Power Part This part consists of the one 3 3V and one 1 8V regulators to convert power which is provided 5V in Power board 15V is provided for inverter in L226WTQ WTG Also 5V is converted 3 3V and 1 8V by regulator Converted power is provided for IC in the main board The inverter converts from DC 15V to AC 700Vrms and operates bac...

Страница 12: ... bridge rectifier and a bulk capacitor 3 Energy Transfer This part function is for transfer the primary energy to secondary through a power transformer 4 Output rectifier and filter This part function is to make a pulse width modulation control and to provide the driver signal to power switch to adjust the duty cycle during different AC input and output loading condition to achieve the dc output s...

Страница 13: ...m is available for LCD Monitor only 1 Port Setup a Copy UserPort sys file to c WINNT system32 drivers folder b Run Userport exe c Remove all default number d Add 300 3FF e Click Start button f Click Exit button 2 EDID Read Write 1 Run WinEDID exe 2 Edit Week of Manufacture Year of Manufacture Serial Number a Input User Info Data b Click Update button c Click Write button ...

Страница 14: ...5 seconds and press MENU POWER switch for 1 second interval 3 The SVC OSD menu contains additional menus that the User OSD menu as described below a CLEAR ETI To initialize using time c Auto Color W B balance and Automatically sets the gain and offset value press key for over 3 sec d AGING Select Aging mode on off b Module To select applied module d NVRAM INIT EEPROM initialize 24C16 press key for...

Страница 15: ...HECK POWER BOARD AND FIND OUT A SHORT POINT AS OPENING EACH POWER LINE CHECK U901 3 3V U902 1 8V LINE NO CHECK CRYSTAL X501 YES YES YES CHECK J905 VOLTAGE PIN5 PIN6 5V IS U901 PIN2 3 3V U902 PIN2 1 8V CHECK X501 PIN127 PULSE 1 2 1 3 1 4 Waveforms 1 J905 5 6 2 U901 2 3 U902 2 4 U501 127 ...

Страница 16: ... CHECK J905 VOLTAGE PIN5 6 5V NO NO NO NO 1 CONFIRM BRIGHTNESS OSD CONTRL STATUS 2 CHECK MICOM DIM ADJ PORT CHECK J905 PIN10 POWER BOARD LIPS CHECK PULSE AS CONTACTING PROBE TO THE LAMP WIRE OF THE LCD MODULE REPLACE LCD MODULE YES 1 2 3 4 YES YES YES Waveforms 1 J905 5 6 2 J905 9 3 J905 10 Brightness 100 5 LAMP CURRENT 3 J905 10 Brightness 0 ...

Страница 17: ...U501 CHECK U501 PIN114 3 3V PIN21 1 8V NO NO NO CHECK U901 3 3V U902 1 8V U501 PIN 127 128 14 3MHZ CHECK CONNECTION LINE FROM D SUB TO U501 TROUBLE IN CABLE OR LCD MODULE YES YES NO RASTER OSD IS NOT DISPLAYED CHECK U501 PIN32 H SYNC AND PIN33 V SYNC IS PULSE APPEARED AT SIGNAL PINS YES 1 Waveforms 1 U501 127 ...

Страница 18: ...OUBLE IN DPM TROUBLE IN DPM TROUBLE IN U501 CHECK PC PC IS GOING INTO DPM MODE NO CHECK H V SYNC LINE NO YES CHECK R718 AND R719 SYNC APPEARED CHECK U501 PIN 32 33 SYNC PULSE YES 1 H SYNC 2 V SYNC Waveforms 1 2 ...

Страница 19: ...EXPLODED VIEW 19 300 520 310 430 330 320 900 910 920 200 500 510 420 410 400 ...

Страница 20: ...VI D SUB Black ACQ31701719 Cover Assembly Rear L225W LM62A 23 Backcover CMO DVI D SUB mercury C SKD For U S A ACQ31701720 Cover Assembly Rear L225W LM62A 23 Backcover LPL DVI D SUB mercury C SKD For U S A ACQ31701701 Cover Assembly Rear L225W LM62A 23 Backcover CMO DVI D SUB C SKD For Japan Russia ACQ31701733 Cover Assembly Rear L225W LM62A 23 Backcover LPL DVI D SUB White EU 410 MGJ33948901 Plate...

Страница 21: ...F56A Capacitor Ceramic Chip0603B104K1 C533 0CK104CF56A Capacitor Ceramic Chip0603B104K1 C534 0CK104CF56A Capacitor Ceramic Chip0603B104K1 C535 0CK104CF56A Capacitor Ceramic Chip0603B104K1 C536 0CK104CF56A Capacitor Ceramic Chip0603B104K1 C537 0CK104CF56A Capacitor Ceramic Chip0603B104K1 C538 0CK104CF56A Capacitor Ceramic Chip0603B104K1 C539 0CC080CK11A Capacitor Ceramic ChipC1608C0G1H C540 0CC080C...

Страница 22: ...0RJ1801D677 Resistor ChipMCR03EZPJ182 1 8KOH R5 0RJ1201D677 Resistor ChipMCR03EZPJ122 1 2KOH R501 0RJ1000D677 Resistor ChipMCR03EZPJ101 100OHM R502 0RJ0562D677 Resistor ChipMCR03EZPJ560 56OHM R503 0RJ1000D677 Resistor ChipMCR03EZPJ101 100OHM R504 0RJ0562D677 Resistor ChipMCR03EZPJ560 56OHM R505 0RJ4700D677 Resistor ChipMCR03EZPJ471 470OHM R506 0RJ1000D677 Resistor ChipMCR03EZPJ101 100OHM R507 0RJ0...

Страница 23: ...sistor ChipMCR03EZPJ000 0OHM 5 R911 0RJ1002D677 Resistor ChipMCR03EZPJ103 10KOHM R912 0RJ3900D677 Resistor ChipMCR03EZPJ391 390OHM C1 6631900109A Harness Single FOOSUNG DCE153B 2 C2 6631V12031F Harness Single12505HS 0400 12505 C3 6631T12006E Harness Single6P 1 25MM _220MM 1 C4 6631T20034P Harness Single11P M203WTB SMH20 J1 6602T12005E Connector Wafer12505WR 06A00 6P J2 6602T12005C Connector Wafer1...

Страница 24: ... 24 PRINTED CIRCUIT BOARD MAIN TOP MAIN BOTTOM ...

Страница 25: ... 25 CONTROL ...

Страница 26: ...SCHEMATIC DIAGRAM 26 1 SCALER ...

Страница 27: ... 27 2 POWER WAFER ...

Страница 28: ... 28 3 CONTROL ...

Страница 29: ...May 2007 P NO MFL38456741 Printed in Korea ...

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