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Lantronix xPico 110, Руководство по интеграции

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3: Mounting Instructions and PCB Footprint 

xPico® 110 Embedded Device Server Integration Guide 

 

26 

(1) Solder paste alloy: SAC305(Sn96.5/Ag3.0/Cu0.5)(Lead free solder 

paste is recommended by Lantronix.) 

(2) A-B. Temp.(Pre-heat): 150~200 °C; soak time:60~120 seconds. 

(3) C. Peak temp: <245 °C 

(4) D. Time above 217 °C: 40~90 sec. 

(5) Suggested optimal cooling rate is <1 °C /sec. from peak to 217 °C. 

(6) Utilize a minimum of nine heater zones for Reflow equipment. 

(7) Nitrogen usage is recommended when the oxygen concentration is 

controlled at less than 1500 ppm. 

Note:

 Need to inspect solder joint by X-ray post reflow for voiding and  

solder shorts. 
 

MSD (Moisture Sensitive Device) Control for the Module 

1.  The xPico embedded device server is a moisture sensitive device; the MSL level is 3. 
2.  Modules to be subjected to reflow solder or other high temperature processes must be 

mounted within 168 hours of opening the vacuum containment bag in factory conditions. 

3.  The module requires baking before mounting, if: 

a.  The Humidity Indicator Card reads >10% when read at 23± 5°C 
b.  The MSL3 are not met 

4.  If baking is required, optional condition as below (refer to IPC/JEDEC J-STD-033): 

a.  Bake 9 hours at 125°C (Tray base) 
b.  Bake 33 hours at 90°C/

≦

5%RH (Tray base) 

c.  Bake 13 days at 40°C/ 

≦

5%RH (Tape/Reel base) 

Note:

 After baking, the floor time of module should be recalculated. The xPico 110 device 

server cannot be exposed to more than three reflow cycles. 

The xPico 110 embedded device server is moisture sensitive and needs to be handled within 

proper MSL 3 guidelines to avoid damage from moisture absorption. After the moisture barrier 

bag (MBB) is opened, the part should go through reflow for board assembly within 48 hours at 

factory conditions of <30°C/60% RH, or stored at <10% RH. If both of these conditions are not 

met, baking is required before board mounting. 
For removal from a customer PCB, the customer PCB must first be baked. Baking should be 

done for a minimum of 8 hours at 125°C. It is recommended that during removal, localized 

heating be used, and the maximum  body temperature of device should not exceed 200°C. 
 
 
 
 
 
 
 
 
 

Содержание xPico 110

Страница 1: ...Part Number 900 782 R Revision A March 2017 xPico 110 Wired Device Server Module Integration Guide ...

Страница 2: ...l Support Online www lantronix com support Sales Offices For a current list of our domestic and international sales offices go to the Lantronix web site at www lantronix com about contact Disclaimer All information contained herein is provided AS IS Lantronix undertakes no obligation to update the information in this publication Lantronix does not make and specifically disclaims all warranties of ...

Страница 3: ... Increase the separation between the equipment and receiver 3 Connect the equipment into an outlet on a circuit different from that to which the receiver is connected 4 Consult the dealer or an experienced radio TV technician for help This device complies with Part 15 of the FCC Rules Operation is subject to the following two conditions 1 This device may not cause harmful interference and 2 this d...

Страница 4: ...________________________________ 9 Ethernet Interface ___________________________________________________ 13 Serial Interface _____________________________________________________ 15 LEDs _____________________________________________________________ 17 General Purpose I O Pins _____________________________________________ 17 Reset Pins_________________________________________________________ 18 Ev...

Страница 5: ...Device Dimensions in mm Part 2 of 2 31 Figure 4 6 Recommended Footprint in mm 31 Figure A 3 Certificate of Compliance for Halogen Free 33 List of Tables Table 2 1 xPico 110 Part Numbers 7 Table 2 3 xPico 110 PCB Interface Signals 9 Table 2 5 Ethernet Interface Signals for xPico 110 13 Table 2 6 Recommended Magnetic Modules and Combo RJ45 Magnetic Module Connectors 13 Table 2 8 xPico 110 Serial Por...

Страница 6: ...documentation for the latest documentation and the following additional documentation Document Description xPico Wired Device Server Module User Guide Provides information needed to configure use and update the xPico firmware xPico Wired Device Server Module User Guide Provides information needed to configure use and update the xPico firmware xPico 110 Evaluation Kit Quick Start Guide Provides the...

Страница 7: ... there is virtually no need to write a single line of code translating to a much lower development cost and faster time to market Table 2 1 xPico 110 Part Numbers Part Number Description XPC100200S 01 xPico 110 Wired Device Server Module SMT AES Industrial Temp 10 pack XPC100200B 01 xPico 110 Wired Device Server Module SMT AES Industrial Temp Tape Reel BULK XPC100200K 01 xPico 110 Evaluation Kit W...

Страница 8: ...unctional Description xPico 110 Wired Device Server Integration Guide 8 Block Diagram The following drawing is a block diagram of the xPico 110 wired device server module Figure 2 2 xPico 110 Block Diagram ...

Страница 9: ... Ethernet magnetic module and RJ45 is required to interface the xPico 110 to a standard 10 100Mbps Ethernet network Shown below is the xPico 110 pin connection diagram Table 2 3 xPico 110 PCB Interface Signals Signal Name Pin Primary Function Reset State Internal Pull up Driver Strength POWER GROUND AND UNUSED PINS GND 1 3 5 20 23 24 27 32 35 36 58 60 61 64 65 69 70 Ground pins for Signal and Powe...

Страница 10: ...tput 2mA RXD2 52 Serial 2 Receive Data Input Active 56K to 122K CONFIGURABLE I O PINS CP1 45 Configurable IO 1 Input Active 56K to 122K 4mA CP2 42 Configurable IO 2 Input Active 56K to 122K 4mA CP3 12 Configurable IO 3 Input Active 56K to 122K 4mA CP4 13 Configurable IO 4 Input Active 56K to 122K 4mA CP5 16 Configurable IO 5 Input 10K 4mA CP6 17 Configurable IO 6 Input 10K 4mA CP7 14 Configurable ...

Страница 11: ...e Low Not 5V tolerant Input 10K DEFAULT 40 Reset Device Configurations to Default Values Active Low See instructions for use Input Active 56K to 122K LED SIGNALS LED0 SPEED 38 Ethernet Speed LED Active Low Output 8mA LED1 LINK 47 Ethernet Link LED Active Low Output 8mA LED2 ACTIVITY 46 Ethernet Activity LED Active Low Output 8mA LED3 DUPLEX 37 Ethernet Duplex LED Active Low Output 8mA SYS_LED 41 D...

Страница 12: ... up Driver Strength TCK 67 JTAG Test Clock For Factory Test Only Do not use leave open TMS 68 JTAG Test Mode Select For Factory Test Only Do not use leave open Note 1 The CP pins can be configured as pull up or pull down Note 2 It is highly recommended to connect RTS and CTS for serial port 1 Figure 2 4 xPico 110 Castellation Pin Out ...

Страница 13: ...00 ohm differential pairs on a layer next to the signal ground plane The use of vias on these signals should be minimized The center tap signal connections between the magnetic and xPico wired module are required Center tap signals RCT and TCT should be routed with at least 20 mil trace thickness The area between the magnetic module and RJ45 jack including the area under both should be voided of a...

Страница 14: ... from POE using a POE magnetic and POE powered device controller Lantronix uses the Silabs Si3402 POE controller to power the xPico development board via POE If using POE the Ethernet magnetic module should be changed to a POE compatible module such as Pulse HX2019 Refer to the evaluation board schematic in the xPico 110 Evaluation Kit User Guide for an example circuit See www lantronix com suppor...

Страница 15: ...a multiprotocol RS232 RS485 RS422 transceiver Single protocol transceivers may be used as required The xPico interface may also be directly connected to the UART interface of an external CPU Serial Port 2 is a three wire interface only It operates like Serial Port 1 except it does not support hardware Flow Control i e no RTS CTS and modem control i e no DTR DCD It is highly recommended to connect ...

Страница 16: ...XDx 2 3 RXDx RTSx H W Flow Control Output 7 4 RTSx 8 5 CTSx CTSx H W Flow Control Input 8 5 CTSx 7 4 RTSx CPx Modem Control Input 1 8 DCDx 4 20 DTRx CPy Modem Control Output 4 20 DTRx 1 8 DCDx Table 2 11 RS422 485 Connections Serial Transceiver Required xPico Signal logic Description RS485 Signal DB25 4 Wire DB25 2 Wire DB9 4 wire DB9 2 wire TXDx Data Out TX 485 14 14 7 7 TXDx Data Out TX 485 15 1...

Страница 17: ...ive low LED2 ACTIVITY 46 Ethernet Activity LED active low LED3 DUPLEX 37 Ethernet Duplex LED active low SYSTEM_LED 41 System status LED active high General Purpose I O Pins The xPico 110 wired device server module has 16 configurable I O pins Listed below are the configurable I O pins These pins are 3 3V CMOS logic level and 5V input tolerant Table 2 13 Configurable I O Pins for xPico 110 Signal P...

Страница 18: ...Pico software When DEFAULT is asserted low for six seconds the unit will reset the system to the default manufacturing settings and reboot the unit Table 2 14 Reset Signals Signal Pin Description Reset State Internal pull up EXT_RESET 51 Unit hardware reset active low Assert low for a minimum of 50 milliseconds then release to reboot unit Signal may be left floating Input 10K DEFAULT 40 Unit reset...

Страница 19: ... TXD1 57 GND58 58 RF1_CTL 59 GND60 60 GND61 61 TRST 62 TDO 63 GND64 64 GND65 65 TDI 66 TCK 67 TMS 68 GND69 69 GND70 70 GND71 71 GND72 72 GND73 73 GND74 74 GND75 75 GND76 76 Caution JTAJ port will need some adjusments when use with DSTni EX design P_ELED1 JP7 1 2 LED6 3V3 EXT_RESET 3V3 LED7 P_ELED2 CP6 CP5 CP1 CP2 CP7 CP8 STATUS_LED R3 1K Status LED LED1 Orange 3V3 Q1 MMBT3904 SOT C1 0 1uF STATUS_L...

Страница 20: ...1D TX1_232 TX 485 DTR1_232 CTSA RX1_232 RX 485 RTS1_232 TX 485 CTS1_232 RX 485 RTSA TXDA RTSA 3V3 3V3 SERIAL_RTS1 U18 PI74ST1G125 2 4 1 3 5 DTRA 3V3 RS232_485_SEL RS485_RS232_SEL This signal is low in RS485 mode This signal is low in RS232 mode R55 10k RXDA C14 0 1uF 50V U19 PI74ST1G125 2 4 1 3 5 DCDA C15 0 1uF 50V DTR1_232 RS485 Mode TX connector Inverted from SP336 so swap TX and RTS when in RS4...

Страница 21: ...18 1Y2 16 1Y3 14 1Y4 12 VCC 20 GND 10 2A1 11 2A2 13 2A3 15 2A4 17 2Y1 9 2Y2 7 2Y3 5 2Y4 3 2OE 19 ORA GRN LED8 SML521MDW 1 3 2 4 RXD1 p2 3 TXD1 p2 3 RX1_LED C27 0 1uF R22 1M UART_ACT4 UART_ACT6 RX2_LED TXD2 TX1_LED RXD2 RX1 LED TX1 LED RX2 LED TX2 LED UART_ACT2 UART_ACT1 UART_ACT3 RS 232 Activity LEDs UART_ACT5 R23 220 R24 220 R26 220 R29 220 C28 0 22uF C29 0 22uF C30 0 22uF C31 0 22uF R27 1K R28 1...

Страница 22: ...2 Functional Description xPico 110 Embedded Device Server Integration Guide 22 Figure 2 18 Evaluation Board Schematic Sheet 4 of 6 POE Power Supply Circuit ...

Страница 23: ...d Magnetic need to be isolated by 1500Vrms to all other signals T1 HX2019 TD 1 TC 2 TD 3 NC4 4 NC5 5 RD 6 RC 7 RD 8 RX 9 RCM 10 RX 11 NC12 12 NC13 13 TX 14 TCM 15 TX 16 3V3 3V3 J2 RJ45 TD 1 SP1 4 TD 2 RD 3 SP1 5 RD 6 SP2 8 SH1 11 SH2 12 SP2 7 MH1 9 MH2 10 Ethernet Connector Route the Ethernet Differential pairs as 100 ohm differential nets on a layer next to the ground plane Minimize the use of Vi...

Страница 24: ... 6 SH2 7 MH1 10 GND 5 NC 4 D 3 D 2 VBUS 1 MH2 11 SH3 8 SH4 9 USB TO SERIAL DEVICE VBUSDEBUG Route the SDDx pair as 90 ohm differential net on a layer next to the ground plane Minimize the use of Vias and keep clear of other nets Diode Array Route through device Install for ESD Protection VUSB F1 500 mA SDDP SDDM USB DEBUG PORT VUSB C62 0 1uF C63 0 1uF C65 0 1uF R47 DNP_1K VUSB PWREN R48 10k VUSB Q...

Страница 25: ...e or no clean solder pastes are acceptable Reflow equipment is needed at nine heater zones at minimum Lantronix recommends a forced air type reflow oven with nitrogen Lantronix recommends that the peak temperature at the solder joint be within 235 C 245 C and the maximum component temperature should not exceed 260 C Lantronix recommends that the solder joint heating time above 217 C last between 4...

Страница 26: ...module requires baking before mounting if a The Humidity Indicator Card reads 10 when read at 23 5 C b The MSL3 are not met 4 If baking is required optional condition as below refer to IPC JEDEC J STD 033 a Bake 9 hours at 125 C Tray base b Bake 33 hours at 90 C 5 RH Tray base c Bake 13 days at 40 C 5 RH Tape Reel base Note After baking the floor time of module should be recalculated The xPico 110...

Страница 27: ...el contains important information about your specific unit such as its part number revision manufacturing date code product model country of origin datamatrix barcode and MAC address Figure 3 2 xPico Product Label Part Number Country of Manufacturing Origin Lantronix Datamatrix Barcode Manufacture Date Code Label Part Number Serial Number Model Name ...

Страница 28: ... 3 15 3 3 3 46 Vdc Supply Voltage Ripples VCC_PP 2 100 BaseTX Active Normal CPU Speed ICC 200 mA 10 BaseT Active Normal CPU Speed ICC 220 mA No Link Normal CPU Speed ICC 150 mA 100 BaseTX Active High CPU Speed ICC 240 mA 10 BaseT Active High CPU Speed ICC 260 mA No Link High CPU Speed ICC 190 mA 100 BaseTX Active Low CPU Speed ICC 170 mA 10 BaseT Active Low CPU Speed ICC 190 mA No Link Low CPU Spe...

Страница 29: ...ammable I O 16 PIO pins software selectable sink or source 4mA max Network Interface 10 100Mbps Ethernet requires external magnetics and RJ45 Compatibility Ethernet Version 2 0 IEEE 802 3 electrical Ethernet II frame type Protocols Supported ARP UDP IP TCP IP Telnet ICMP SNMP DHCP BOOTP TFTP Auto IP SMTP and HTTP LEDs Link Activity Link Speed Duplex System Status logic level outputs Management Int...

Страница 30: ...4 Specifications xPico 110 Embedded Device Server Integration Guide 30 xPico 110 Mechanical Dimensions Figure 4 4 Device Dimensions in mm Part 1 of 2 ...

Страница 31: ...4 Specifications xPico 110 Embedded Device Server Integration Guide 31 Figure 4 5 Device Dimensions in mm Part 2 of 2 Figure 4 6 Recommended Footprint in mm ...

Страница 32: ...0 Class B Conducted Emissions CFR Title 47 Part 15 Subpart B Class B Emissions Table A 2 Electromagnetic Immunity Test Description Specification Test Method ESD EN 55024 2010 EN 61000 4 2 2009 Radiated Immunity EN 55024 2010 EN 61000 4 3 2010 EFT EN 55024 2010 EN 61000 4 4 2004 Surge EN 55024 2010 EN 61000 4 5 2005 Conducted Immunity EN 55024 2010 EN 61000 4 6 2009 Magnetic Field Immunity EN 55024...

Страница 33: ...xPico 110 Embedded Device Server Integration Guide 33 Figure A 3 Certificate of Compliance for Halogen Free ...

Страница 34: ...here is no guarantee that interference will not occur in a particular installation If this equipment does cause harmful interference to radio or television reception which can be determined by turning the equipment off and on the user is encouraged to try to correct the interference by one of the following measures Reorient or relocate the receiving antenna Increase the separation between the equi...

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