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2: Functional Description
xPico® 110 Embedded Device Server Integration Guide
23
Figure 2-19 Evaluation Board Schematic, Sheet 5 of 6
Note:
R10, R11, R19, R46, and R56 could be 0 ohm resistors, ferrites, or ceramic capacitors for EMC purpose, recommended
0.001uF.
U1
RClamp0502A
1
1
GND
2
3
3
4
4
VDD
5
6
6
U2
RClamp0502A
1
1
GND
2
3
3
4
4
VDD
5
6
6
Diode Array
Route through device
Install for ESD Protection
ERX+
ETX-
ERX-
C9
0.01uF, 200V
C10
1000pF/2kV
1
2
C8
0.01uF, 200V
C7
0.01uF, 200V
C6
0.01uF, 200V
R15
75
ETX+
R14
75
R13
75
R12
D75
TXCT
ETX-
SPARE2
ERX-
RXCT
ERX+
TAP1
ETXM
ERXP
TAP2
ERXM
Magnetics
SPARE1
ETH_SHELL
ETXP
R10
DNP_0
R11
DNP_0
Signals in this box between RJ45 and Magnetic need
to be isolated by 1500Vrms to all other signals.
T1 HX2019
TD+
1
TC
2
TD-
3
NC4
4
NC5
5
RD+
6
RC
7
RD-
8
RX-
9
RCM
10
RX+
11
NC12
12
NC13
13
TX-
14
TCM
15
TX+
16
3V3
3V3
J2
RJ45
TD+
1
SP1+
4
TD-
2
RD+
3
SP1-
5
RD-
6
SP2-
8
SH1
11
SH2
12
SP2+
7
MH1
9
MH2
10
Ethernet
Connector
Route the Ethernet Differential
pairs as 100 ohm differential nets on a layer
next to the ground plane.
Minimize the use of Vias and keep
clear of other nets.
Use 20 mil trace on RXCT and TXCT.
Void area under Magnetic and RJ45 Jack
of all signals except the signals from the
Magnetic to the RJ45.
ESD Protection
Diode Array
Route through device
Install for ESD Protection
ETX+
ERX+
p2
ETX+
p2
ERX-
p2
ETX-
p2
ETH_SHELL
ETH_SHELL = GND_EARTH
via the J2 shell
Components in this page are not populated if Ethernet Circuit is not used.
TAP1 p5
TAP2 p5
SPARE1 p5
SPARE2 p5
TXCT
p2
RXCT
p2
Ethernet Circuit