7: Mounting
GPS/GLONASS Receiver Module A5100-A User Guide
30
7.2 Recommended Profile for Reflow Soldering
Typical values for reflow soldering of the module in convection or IR/convection ov-
ens are as follows (according to IPC/JEDEC J-STD-020D):
Parameter
Value
Peak temperature (RoHS compliant process)
245°C
Average ramp up rate to peak (217°C to Peak)
3°C / second max.
Preheat temperature
min=150°C; max=200°C
Ramp up time from min. to max. preheat temperature
60 … 120 seconds
Temperature maintained above 217°C
60 … 150 seconds
Time within 5°C of actual peak temperature
30 seconds
Ramp down rate
6°C / second max.
Time 25°C to peak temperature
8 minutes max.
Table 9: Reflow soldering profile A5100-A
The solder pads hold solder of a thickness of about 150 µm for improved solder pro-
cess results.
As results of soldering may vary among different soldering systems and types of sol-
der and depend on additional factors like density and types of components on board,
the values above should be considered as a starting point for further optimization.
