21
Hardware Setup
Chapter 5
Embedded and Industrial Computing
Chapter 5:
Hardware Setup
Preparing the Hardware Installation
To access some components and perform certain service
procedures, you must perform the following procedures
first.
WARNING:
To reduce the risk of personal injury,
electric shock, or damage to the equipment,
remove the power cord to remove power from
the server. The power switch button does not
completely shut off system power. Portions of the
power supply and some internal circuitry remain
active until AC power is removed.
Unpower the LVC-5550S and remove the power cord.
1.
Turn the device upside down.
2.
Unscrew the 4 screws from the suspension kit of the
3.
LVC-5550S System.
Before opening the case, the front panel has to be
4.
released. To do this, unscrew 7 screws from the front
pane and the HDD cover.
Lift the cover upwards.
5.
System Memory Installation
The motherboard supports DDR3 memory to meet the
higher bandwidth requirements of the latest operating
system and Internet applications. It comes with one
Double Data Rate(DDR3) Small Outline Dual Inline Memory
Module (SO-DIMM) socket.
Align the memory module’s cutout with the SO-DIMM
1.
socket’s notch.
Install the SO-DIMM.
2.
Note:
The system can support DDR3 memory up to 4 GB on
its SO-DIMM socket.
CompactFlash Card Installation
The LVC-5550S provides one CompactFlash slot. Follow
the procedures bellow for installing a CompactFlash card.
Align CompactFlash card and the card slot with the
1.
arrow pointing toward the connector. The slot is
notched to prevent insertion in the wrong orientation
. Do not force the card into the connector.
Push the card to insert into the connector.
2.
3G and Wireless Module Installation
Align the wireless module’s cutout with the Mini-PCIe
1.
slot notch.
Insert the wireless module into the connector
2.
diagonally.
Push the other end of the wireless module and secure
3.
it in place with the screws.
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