Laird BL654PA, Руководство пользователя

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Plated Through Holes or Header Connector BL654PA Module Signals Exposed
J36
BL654PA pin plated holes for access:
SI0_ 09 via R100 0R (default NOPOP)
SI0_ 10 via R101 0R (default NOPOP)
To use NFC1 pin as SIO_09 fit R100 0R and
NOPOP R98.
To use NFC1 pin as SIO_09 fit R101 0R and
NOPOP R99.
The BL654PA development board provides for simple and hassle-free connectivity to a wide range of sensors, but also
includes several on-board sensors and options to enable a developer to test functionality straight out of the box.
In the smart BASIC application code written to use sensors on the development board, including the Temperature sensor (U1)
– analog output, SPI EEPROM (U2), I2C RTC chip (U16), LED1(D1), LED2(D2), LED3(D3), LED4(D4) Button1(SW1),
Button2(SW2), Button3(SW9) and Button4(SW10) the SIO pins direction and type must be set in the
smart BASIC application
to override the defaults in the BL654PA firmware.
For more information on these sample applications, see GitHub smart BASIC sample applications repository on the BL654PA
product page at https://github.com/LairdCP/BL654PA-Applications.
The temperature sensor (U1) by default is connected to the BL654PA module as jumper on J6 pin bridges TEMP_SENS and
SIO_03.
Figure 15: Temperature sensor schematic and PCB
The on-board temperature sensor (TI LM20BIM7 - www.ti.com/lit/ds/symlink/lm20.pdf ) has an analogue output that can be
connected to BL654PA module pin SIO_03; but since the LM20BIM7 has an analogue output, the BL654PA module SIO_03
C53
300pF,50V
R100 NOPOP (0R)
R101 NOPOP (0R)
C54
300pF,50V
GND
PIN HEADER,2.54mm 1X2P
J36
1
1
2
2
GND
R98
0R
CON2
FFC/FPC,SMD/90d
1
1
2
2
3
3
4
4
5
5
GND
6
GND
7
NFC1_SIO_09
R99
0R
NFC2_SIO_10
SIO_03
C2
0.1uF,16V
Analog output temp sensor
V+ 2.4V-3.6V
C3
0.1uF,16V
PIN HEADER,2.54mm 1X2P
J6
1
1
2
2
VCC_3V3
Temp_Sens
GND GND GND GND
R5
NOPOP (4.7K)
U1
2.4V,10uA,-55dC~+130dC
V+
4
GND
5
Vo
3
GND
2
NC
1
R4
470R,1%
J6