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CP6924-1-RA-A User Guide
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1.1.1.3
IPMI
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NXP LPC2368 32-Bit Microcontroller
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PICMG 2.9 / IPMI 1.5 compliant
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Dual Image Support
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2 MByte Flash (Boot Image)
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64 kByte EEPROM (FRU)
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Board Voltage and current monitoring
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Board Temperature monitoring via I²C enabled sensors
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Switchable pull ups at IPMB0/1 backplane signals
1.1.1.4
Power Supply
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5V and 3.3V only board, no 12V or -12V required
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IPMB_PWR used for 3.3V PM (generated by LDO)
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Hot Swap support
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3V3 V stabilization
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Point of Load Converters for chip core voltages
1.1.1.5
Miscellaneous
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JTAG Boundary Scan support
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Board layout is prepared for conduction cooling
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All parts are extended temperature range parts: -40°C to +85°C or better
1.1.2
General compliances
The Board is compatible to the following standards:
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PICMG® 2.0 R3.0 CompactPCI® Specification, as amended by ERN 2.0-3.0-002
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PICMG® 2.1 R2.0 CompactPCI® Hot Swap Specification
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PICMG® 2.9 R1.0 CompactPCI® System Management Specification
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PICMG® 2.16 R1.0 Sep. 5, 2005 Packet Switching Backplane Specification
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Intelligent Platform Management Interface Specification V1.5
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IEEE 802.3, 2008 section 3
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IEEE 802.3 2008 section 4 Clause 47 XGMII Extender Sublayer (XGXS) and 10 Gigabit Attachement Unit Interface
(XAUI)
