Kollmorgen Digital MMC Control, Руководство по оборудованию

Страница: 25 / 322

Kollmorgen - December 2011 23
MMC Smart Drive Hardware Manual
-
INSTALLING THE MMC SMART DRIVE
4. Turn the threaded bolts into the subpanel mounting holes.
5. Slide a star washer onto the threaded end of the bolt.
6. Turn and tighten a nut onto the stud.
7. Slide a flat washer onto the threaded end of the bolt.
8. Position the mounting holes on the groundbus or mounting bracket over the
threaded bolts and turn the bolts until they come through the grounding bus or
mounting bracket.
9. Slide a star washer onto the threaded end of the bolt.
10. Slide a flat washer onto the threaded end of the bolt.
11. Turn and tighten a nut onto the bolt.
3.9.4 Grounding Multiple Drive Cabinets
1. Mount one bonded ground bus in each cabinet.
2. Designate the cabinet ground bus in one and only one of the cabinets as the com-
mon ground bus for all of the cabinets in the system.
3. Connect the ground wires from the ground bus in each individual cabinet ground
bus to the designated common ground bus (mounted in only one of the cabinets).
4. Connect the common cabinet ground bus to an external ground system that is
connected to a single point ground.
3.9.5 Bonding Multiple Subpanels
Kollmorgen recommends bonding both the top and bottom of subpanels sharing the
same enclosure. Use a 25.4 mm (1.0 in.) x 6.35 mm (0.25) wire braid. Be sure the
area around each wire braid fastener is clear of any non-conductive materials. Bond
the cabinet ground bus to at least one of the subpanels.
3.10 Drive Mounting Guidelines
• A control cabinet for the MMC Smart Drive should have a NEMA-12 rating or bet-
ter. A cabinet with this rating protects its contents from dust and mechanical dam-
age.
• The cabinet must be large enough to provide adequate air circulation for the MMC
Smart Drive and other components. Always allow for adequate air flow through
the MMC Smart Drive vents.
• The cabinet must have a rigid non-painted galvanized metal surface to mount the
MMC Smart Drive on.
NOTE
Subpanels that are not bonded together may not share a common low im-
pedance path. This difference in impedance may affect networks and other
devices that span multiple panels.