Keithley 7015-C, Инструкция по эксплуатации

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3 Card Connections & Installation
3.1 Introduction ..........................................................................................................................................................3-1
3.2 Handling
precautions............................................................................................................................................3-1
3.3 Connections ..........................................................................................................................................................3-1
3.3.1
Bank-to-bank jumpers ..................................................................................................................................3-2
3.3.2 Backplane jumpers .......................................................................................................................................3-3
3.3.3 Screw terminal connector card .....................................................................................................................3-4
3.3.4 Multi-pin (mass termination) connector card ...............................................................................................3-6
3.4 Typical connection schemes...............................................................................................................................3-10
3.4.1 Single card system ......................................................................................................................................3-10
3.4.2 Two-card system ........................................................................................................................................3-13
3.4.3 Multiple-card systems ................................................................................................................................3-13
3.4.4 Two-mainframe system ..............................................................................................................................3-13
3.5 Model 7015 installation and removal .................................................................................................................3-18
4 Operation
4.1 Introduction ..........................................................................................................................................................4-1
4.2
Maximum signal levels.........................................................................................................................................4-1
4.3 Mainframe control of multiplexer card ................................................................................................................4-1
4.3.1 Channel assignments ....................................................................................................................................4-1
4.3.2 Front panel control .......................................................................................................................................4-3
4.3.3 IEEE-488 bus operation ...............................................................................................................................4-4
4.4 Multiplexer applications .......................................................................................................................................4-5
4.4.1 High-speed scanning ....................................................................................................................................4-5
4.4.2 Resistor testing .............................................................................................................................................4-7
4.4.4 Testing with matrix cards ...........................................................................................................................4-10
4.4.3 Transistor current gain testing ....................................................................................................................4-10
4.5 Measurement considerations ..............................................................................................................................4-12
4.5.1 Thermoelectric potentials ...........................................................................................................................4-12
4.5.2 Channel resistance ......................................................................................................................................4-13
4.5.3 Path isolation ..............................................................................................................................................4-14
4.5.4 Magnetic fields ...........................................................................................................................................4-15
4.5.5 Radio frequency interference .....................................................................................................................4-15
4.5.6 Ground loops ..............................................................................................................................................4-15
4.5.7 Keeping connectors clean...........................................................................................................................4-16
4.5.8 Scanning speed considerations ...................................................................................................................4-16
5 Service Information
5.1 Introduction ..........................................................................................................................................................5-1
5.2
Handling and cleaning precautions ......................................................................................................................5-1
5.3 Performance verification .....................................................................................................................................5-2
5.3.1 Environmental conditions.............................................................................................................................5-2
5.3.2 Recommended equipment ............................................................................................................................5-2
5.3.3 Multiplexer card connections .......................................................................................................................5-3
5.3.4 Channel resistance tests ................................................................................................................................5-3
5.3.5 Offset current tests........................................................................................................................................5-4
5.3.6 Contact potential tests...................................................................................................................................5-6
5.3.7 Bank and channel-to-channel isolation tests ................................................................................................5-7
5.3.8 Differential and common-mode isolation tests...........................................................................................5-11
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