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SCHEMATIC DIAGRAMS
UX-G300B,UX-G300E,UX-G300EN,UX-G300EV
UX-G303E,UX-G303EN,UX-G303EV,UX-G305E
UX-G305EN,UX-G305EV,UX-G300A,UX-G300US
UX-G300UF,UX-G300UT,UX-G300UW,UX-G300UG
UX-G300UN,UX-G305UT
Contents
Block diagrams
Standard schematic diagrams
Printed circuit boards
2-1
2-2
2-10 to 12
DVD-ROM No.SML2008Q2
MICRO COMPONENT SYSTEM
No.MB665SCH<Rev.004>
2008/9
COPYRIGHT 2008 Victor Company of Japan, Limited.
Lead free solder used in the board (material : Sn-Ag-Cu, melting point : 219 Centigrade)
Lead free solder used in the board (material : Sn-Cu, melting point : 230 Centigrade)
UX-G300EV
UX-G303EV
UX-G305EV
CA-UXG300
SP-UXG3
00
SP-UXG300
Содержание SP-UXG300
Страница 21: ... No MB665 Rev 004 1 21 SECTION 5 TROUBLESHOOTING This service manual does not describe TROUBLESHOOTING ...
Страница 37: ... M E M O ...
Страница 57: ...3 19 MEMO ...