<Touch board>
(Lead free solder used in the board (material : Sn-Ag-Cu, melting point : 219 Centigrade))
(Lead free solder used in the board (material : Sn-Cu, melting point : 230 Centigrade))
F1F
S1F
GVA10177- A1
STAMPING DATE CODE
D9008
D9007
D9009
D9010
D9011
D9001
D9003
D9002
D9012
MARK
UL
D9004
PbF
D9005
D9006
created date:2010-02-02
No.MB726
(No.MB726<Rev.001>)28/36