P1F
T1F
B3.3V
BGND
RE
M
M_LED
D6
V
D890
0
FW315
R8900
C8850
IC880
C9851
R8901
<Sensor board>
(Lead free solder used in the board (material : Sn-Ag-Cu, melting point : 219 Centigrade))
(Lead free solder used in the board (material : Sn-Cu, melting point : 230 Centigrade))
created date:2010-02-02
No.MB726
(No.MB726<Rev.001>)27/36