<Sensor board>
(Lead free solder used in the board (material : Sn-Ag-Cu, melting point : 219 Centigrade))
(Lead free solder used in the board (material : Sn-Cu, melting point : 230 Centigrade))
S1F
GVA10182-A8
B3.3
BGND
RE
M
M_LE
D
D6V
D8900
FW315
MARK
UL
IC880
PbF
created date:2010-02-02
No.MB726
(No.MB726<Rev.001>)26/36