<Sub board (524UI,525U,525UH,525UN,526U,526UH,526UN,526UT,528J)>
(Lead free solder used in the board (material : Sn-Cu, melting point : 230 Centigrade))
(Lead free solder used in the board (material : Sn-Ag-Cu, melting point : 219 Centigrade))
F1A
S1
A
GEA10305A2
PbF
D624
created date:2011-03-04
No.MA479
(No.MA479<Rev.002>)20/23