<Main board (KD-BTP50J,52U)>
(Lead free solder used in the board (material : Sn-Cu, melting point : 230 Centigrade))
(Lead free solder used in the board (material : Sn-Ag-Cu, melting point : 219 Centigrade))
A
GEA10301-
N
N
N
N
ULMARK
A
A
S2A
1
1
L702
B925
B552
B551
C913
B315
B924
B314
C963
J321
C962
B503
B782
B783
B784
B914
B911
B186
B189
B190
B175
B185
B184
B176
B170
B311
B251
B5
B4
B180
B179
B178
B177
B182
B2
B3
B192
B301
B529
B528
B527
B765
B307
B313
B535
B922
IC301
B909
B901
IC901
B920
B919
J120
C251
L901
B763
B913
B764
B790
B791
B191
B541
B789
B766
B767
B792
B768
B793
B762
B174
B173
B183
B181
L981
B540
B539
B542
B543
B532
B533
B534
B538
B537
B536
B785
B786
B787
B531
B788
B167
L7
B778
B780
B779
B776
B772
B777
B775
B760
B773
B774
B761
B188
B169
B168
B187
B166
B164
B163
B171
B172
B918
B912
B910
B908
B907
B906
B905
B904
B903
B902
B915
B917
B916
B921
B302
B303
B304
B305
B306
B309
B310
C252
B308
B165
C584
C590
C591
C586
C514
X540
CN502
B781
B933
R903
R902
B771
CN701
C704
C330
C320
C881
C907
C304
C303
C301
C302
C932
C310
L9
L3
J1
X701
X1
X702
S701
R901
L4
L701
PP1
L8
L1
L5
L6
L2
D901
CN90
1
C162
C906
C903
C172
C340
C350
C901
C24
C25
C174
C160
C309
C910
C904
created date:2011-03-04
No.MA479
(No.MA479<Rev.002>)14/23