P4A
T4A
IC480
IC402
CN802
TP345
TP344
X301
IC701
CN801
IC502
IC301
Ripping module board
(Lead free solder used in the board (material : Sn-Ag-Cu, melting point : 219 Centigrade))
(Lead free solder used in the board (material : Sn-Cu, melting point : 230 Centigrade))
created date:2009-09-08
No.MB711
(No.MB711<Rev.002>)34/35
Содержание CA-NXD5
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