P1G
T1G
A
AUDIO IN
HP
1
7
USB A
USB B
A
USB C
GVA10176-A4
5V D- D+
GND GND
5V
D- D+
GND GND
5V
D+
D-
GND GND
HPR AGND HPL
AUX
L
HPSW
AGND
AUX
R
K8105
K8104
W8100
W8301
W8400
D8400
J8400
J8401
C8404
D8401
D8201
D8301
C8104
C8204
C8304
C8101
C8102
C8201
C8202
C8301 C8302
D8100
D8101
D8200
D8300
C8405
R8100
R8101
R8300
R8301
R8201
R8200
R8451
R8452
R8404
R8403
CN840
K8103
K8203
K8304
K8101
D8103
K8100
C8100
D8102 C8103
J8100
K8102
K8202
W8200
D8203
K8200
C8200
D8202 C8203
J8200
K8201
K8320
C830
0
C8303
K8301
D8303
W8300
K8300
J8300
D8302
C8403
K8452
C8400
K8451
K8450
C8453
C8402
C8401
C8452
C8450
K8401
K8402
D8451 D8450
K8400
Jack board
(Lead free solder used in the board (material : Sn-Ag-Cu, melting point : 219 Centigrade))
(Lead free solder used in the board (material : Sn-Cu, melting point : 230 Centigrade))
created date:2009-09-08
No.MB711
(No.MB711<Rev.002>)23/35
Содержание CA-NXD5
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