9
Intersil Corporation reserves the right to make changes in circuit design, software and/or specifications at any time without notice. Accordingly, the
reader is cautioned to verify that the Application Note or Technical Brief is current before proceeding.
For information regarding Intersil Corporation and its products, see www.intersil.com
AN1386.1
December 23, 2009
FIGURE 13. BOTTOM LAYER (COMPONENT SIDE MIRRORED)
FIGURE 14. BOTTOM-OVER LAYER (COMPONENT LOCATION MIRRORED)
Printed Circuit Board Layers
(Continued)
Application Note 1386
