iii
USER’S NOTICE
COPYRIGHT OF THIS MANUAL BELONGS TO THE MANUFACTURER. NO PART OF THIS
MANUAL, INCLUDING THE PRODUCTS AND SOFTWARES DESCRIBED IN IT MAY BE
REPRODUCED, TRANSMITTED OR TRANSLATED INTO ANY LANGUAGE IN ANY FORM OR
BY ANY MEANS WITHOUT WRITTEN PERMISSION OF THE MANUFACTURER.
THIS MANUAL CONTAINS ALL INFORMATION REQUIRED FOR THE UTILIZATION OF P45
EXPRESS INTEL EDITION MOTHER-BOARDS TO MEET THE USER’S REQUIREMENTS. BUT
IT WILL CHANGE, CORRECT AT ANY TIME WITHOUT NOTICE. MANUFACTURER PROVIDES
THIS MANUAL “AS IS” WITHOUT WARRANTY OF ANY KIND, AND WILL NOT BE LIABLE FOR
ANY INDIRECT, SPECIAL, INCIDENTIAL OR CONSEQUENTIAL DAMAGES (INCLUDING
DAMANGES FOR LOSS OF PROFIT, LOSS OF BUSINESS, LOSS OF USE OF DATA,
INTERRUPTION OF BUSINESS AND THE LIKE).
PRODUCTS AND CORPORATE NAMES APPEARING IN THIS MANUAL MAY OR MAY NOT BE
REGISTERED TRADEMARKS OR COPYRIGHTS OF THEIR RESPECTIVE COMPANIES, AND
THEY ARE USED ONLY FOR IDENTIFICATION OR EXPLANATION AND TO THE OWNER’S
BENEFIT, WITHOUT INTENT TO INFRINGE.
Manual Revision Information
Reversion
Revision History
Date
2.0
First Edition Aug, 2008
Item Checklist
5
Intel P45 Express and ICH10 chipset based Motherboard
5
CD for motherboard utilities
5
8 in 1 cable package
（
Optional
）
5
4 in 1 cable package
（
Optional
）
5
Intel P45 Express and ICH10 chipset based Motherboard User’s Manual
5
Motherboard Quick Installation Guide
5
I/O Back Panel Shield
Intel Core Processor Family
Cooling Solutions
As processor technology pushes to faster speeds and higher performance, thermal management
becomes increasingly crucial while building computer systems. Maintaining the proper thermal
environment is the key to reliable, long-term system operation. The overall goal in providing the
proper thermal environment is keeping the processor below its specified maximum case temperature.
Heat sinks induce improved processor heat dissipation through increased surface area and
concentrated airflow from attached fans. In addition, interface materials allow effective transfers of
heat from the processor to the heat sink. For optimum heat transfer, Intel recommends the use of
thermal grease and mounting clips to attach the heat sink to the processor.
When selecting a thermal solution for your system, please refer to the website below for collection of
heat sinks evaluated and recommended by Intel for use with Intel processors. Note, those heat sinks
are recommended for maintaining the specified Maximum T case requirement. In addition, this
collection is not intended to be a comprehensive listing of all heat sinks that support Intel processors.
